IIC Shenzhen 2024 – Welcome to the Aspencore Global CEO Summit
Latest update time：2024-10-29
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IIC Shenzhen – 2024 International Integrated Circuit Exhibition and Conference will be held at Shenzhen Futian Convention and Exhibition Center from November 5 to 6.
Mr. Doug Bailey, Vice President of Marketing of PI,
will attend the Global CEO Summit on November 5 and give a keynote speech to analyze the market trend of replacing silicon carbide with high-voltage gallium nitride. Please scan the QR code below to register.
Speech Time
November 5 (Tuesday) 13:55-14:20
Speech Topic
Will SiC Survive The Emergence of Super-High Voltage GaN?
Can Silicon Carbide Withstand the Impact of Ultra-High Voltage Gallium Nitride?
Speaker
Doug Bailey
VP Marketing , Power Integrations
Gallium nitride not only outperforms silicon carbide in performance, but also has manufacturing cost advantages, but its voltage resistance is low, and its application is limited to consumer products and mains power occasions. PI is accelerating the development of higher-voltage gallium nitride technology. This speech explains the performance comparison between gallium nitride and silicon carbide from a higher perspective and proposes a future business roadmap.
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