Dual-core + multi-protocol + more secure: this is the standard configuration of the new generation of wireless MCU
Single-chip dual-core MCU supports Bluetooth 5, Thread and Zigbee while improving security for consumer and industrial IoT devices
Many of today's devices require a host microcontroller (Host MCU) to connect to a wireless network, which increases size and complexity, while also making design, software development, procurement, supply chain and logistics more complicated. The new K32W0x wireless MCU platform, representing a new generation of Kinetis MCUs, as part of NXP's broad edge computing portfolio, can make devices more powerful and secure.
The K32W0x platform is a complementary and enhanced version of its predecessor, addressing the evolving IoT landscape with higher performance, more features and higher security. This new platform is the first single-chip device with dual-core architecture and embedded multi-protocol RF, enabling IoT product developers to obtain a range of services from silicon chips, software, tools, support to procurement through a single supplier, thereby reducing the overall complexity, size and cost of the product while improving functionality and security.
Dual-core multi-protocol
As the first product of NXP's new generation of Kinetis MCUs,
the
K32W0x
MCU platform integrates the main controller and wireless MCU into a small device, miniaturizing complex applications that previously required larger and more expensive dual-chip solutions. Consumer devices (such as wearable devices, smart door locks, thermostats and other smart home devices) and various health care, commercial and industrial IoT applications can benefit from the
multi-protocol RF and powerful performance advantages of the
K32W0x
wireless MCU platform.
Key features of the K32W0x wireless MCU platform:
Dual core: Arm Cortex-M4 core for high-performance application processing and Cortex-M0+ core for low-power connectivity and sensor processing
Large memory: 1.25 MB flash and 384 kB SRAM support full-featured applications and connection protocols
Multi-protocol RF: Supports Bluetooth 5 and IEEE 802.15.4, including IP-based Thread Mesh network protocol stack and ZigBee 3.0 Mesh network protocol stack
Supports HomeKit and connects to iCloud via Bluetooth 5
K32W0x Wireless MCU System Block Diagram
Higher security
Many of today’s IoT devices do not have the security levels required to protect against security threats that could compromise networks. Protecting against these evolving threats is a
primary focus of the
K32W0x
platform – designed to ensure the confidentiality, integrity and authenticity of IoT devices and their data.
Security features of the
K32W0x
security system include:
Cryptographic subsystem (including dedicated cores, dedicated instructions, and data memory) for encryption, signing, and execution of hash algorithms (including AES, DES, SHA, RSA, and ECC)
Secure Key Management for storing and protecting sensitive security keys
Erases cryptographic subsystem memory (including security keys) upon detection of a security breach or physical tampering event
Resource domain controller for access control, system memory protection, and peripheral device isolation
Built-in secure boot and secure over-the-air programming (OTA) to ensure only authorized and authenticated code runs in the device
To expand the on-chip security features of the K32W0x MCU platform, NXP has collaborated with B-Secur, a leader in biometric authentication, to develop a system that uses an individual’s unique heartbeat pattern (electrocardiogram/ECG) to verify identity. This system is more secure than using a person’s fingerprint or voice authentication. NXP fully demonstrated this innovative technology at the 2018 Embedded World.
K32W0x supports multiple RF wireless interconnection protocols
The K32W0x platform is sampling now and is scheduled to be generally available in late Q3. For more information on the K32W0x MCU platform, visit www.nxp.com/K32W0x .
"LOOK
Predicting 2018: New Highlights in Embedded Development
The interaction between people and smart devices and services has become an integral part of modern life. From home automation to manufacturing, healthcare and even transportation, everyone relies heavily on secure smart connections. At the 2018 Embedded World (February 27-March 1, Nuremberg, Germany), NXP Semiconductors, a leader in embedded semiconductors and the world's largest supplier of automotive semiconductor solutions, showcased its latest innovations in smart edge computing, terminal nodes, connected cars and industrial systems.
We have specially launched a series of reports on the "NXP 2018 Embedded Systems Exhibition" to allow everyone to experience these innovative technologies in the field of embedded system development as if they were there, and gain insights into development opportunities.
For the latest news, please continue to follow the follow-up reports of the "NXP Inn" WeChat public account, or visit the NXP 2018 Embedded Systems Expo News Center .
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