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Towards the SiC era: let this WolfPACK power module help you accelerate!

Latest update time:2023-12-13
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In the field of power electronics, the application development of SiC (silicon carbide) is on the fast track. Everyone must agree on this.

Compared with traditional Si (silicon) materials, SiC has a wider bandgap, higher critical breakdown electric field, higher thermal conductivity, higher carrier saturation drift rate, and higher tolerance to Operating temperature, this means that power devices based on SiC can significantly improve performance, achieve excellent current carrying capacity and lower switching losses, allowing converters to have higher efficiency and power density. Because of this, more and more engineers are choosing SiC power semiconductors as a solution.


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Wolfspeed is a global third-generation semiconductor leader with a rich SiC product portfolio. SiC discrete devices with voltage ranges from 650V to 1700V have high topology flexibility and can meet power density, efficiency and scalable solutions; today we will focus on a new SiC product from Wolfspeed - to meet medium power requirements. Press-fit substrate-less WolfPACK series SiC power modules developed by Application.



For engineers designing power electronics in the mid-power range, increasing power density and reducing design complexity are two prominent "pain points", and these are the two highlights of the Wolfspeed WolfPACK module.

Wolfspeed WolfPACK series power modules use SiC array topology to provide optimized power modules for various applications (such as half-bridge, full-bridge, six-tube integration (three-phase), etc.). The package is compatible with traditional Si substrate-less modules, allowing designers to upgrade reliably and quickly. The higher power density achieved in WolfPACK's baseless package, coupled with SiC technology, enables compact layout, faster and simpler switching, which can reduce the volume for designers by up to 25%. In addition to power density advantages, Wolfspeed WolfPACK modules simplify system layout and assembly processes. This allows engineers working on mid-power 10kW to 100+kW applications to significantly increase power density while minimizing design complexity.


The high power density of SiC modules makes the design of the thermal interface between the power module and the heat sink a serious challenge for engineers. In this regard, Wolfspeed WolfPACK power modules can choose to be pre-coated with Honeywell thermal interface material (TIM) to solve this problem. Pre-coated thermal interface materials for power modules can shorten processing time in manufacturing, simplify installation steps, increase system reliability, extend system life, optimize heat dissipation management, improve installation and maintenance, and provide optimal thermal resistance characteristics.

Wolfspeed WolfPACK power modules also feature press-fit pin technology, a proven connection method that utilizes pins with an arcuate body. The pins are compressed when inserted into plated PCB through-holes. This compression provides high reliability and excellent electrical/thermal/mechanical properties without the need for further tightening, specialized parts or soldering.

In summary, the inherent simplicity of WolfPACK SiC power modules enables a high degree of scalability, helping to speed up production processes and reduce system assembly costs while providing designers with a power portfolio suitable for a variety of applications.




Application Summary

Improving efficiency and system performance while maintaining cost-effectiveness and compact form factor has always been a goal pursued in the power electronics field. Against this background, SiC devices and solutions are being introduced into the power electronics industry at an accelerated pace and becoming standard equipment for more application designs. This is the general trend.


The high power/high current capability of Wolfspeed WolfPACK modules greatly simplifies the design of mid-power converters, making them more scalable and taking up less space, allowing for higher power density. Wolfspeed WolfPACK modules are available in a range of different sizes and configurations, allowing many power systems to be quickly developed, easy to build and maintain, and highly reliable in the field. They are ideal for many medium power electronics solutions, including electric Many applications such as automobile fast charging, industrial power supplies, uninterruptible power supplies, induction heating and welding, industrial motor drives, photovoltaics, energy storage, network infrastructure, etc. can benefit from it and quickly complete the transformation from traditional Si-based The plan is to upgrade technology to a new generation of SiC solutions.



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