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We’re always excited to see a new Apple iPhone, and this year’s iPhone 11 series is no exception.
This is the first time Apple has released an iPhone with three rear cameras.
The mysterious U1 chip also appeared on the screen at Apple’s event, but no one on stage mentioned it.
And let’s not forget that Apple is replacing the 7000-grade aluminum alloy body with 100% recycled aluminum—mainly for environmental reasons.
The iPhone 11 Pro Max we have in our hands is the Midnight Green model with model number A2161 and 512GB of memory.
The following annotated board image shows the good design we have identified so far.
The A13 Bionic has an Apple part number APL1W85.
It uses an A13 application processor and a Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM in a package-on-package (PoP), the same 4GB DRAM capacity as the previous generation iPhone Xs Max launched last year.
Update:
The die marking of A13 Bionic APL1W85 is TMKF47.
The die size (die edge) is 10.67mm x 9.23mm = 98.48 mm2, which is 18.27% larger than the previous A12.
According to TechInsights, the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM has four identical 1y nm dies.
As expected, Intel provides the mobile chipset for the iPhone 11.
The baseband processor is the Intel PMB9960, which is most likely the XMM7660 modem.
According to Intel, the XMM7660 is its sixth-generation LTE modem that meets 3GPP Release 14.
It supports downlink speeds of up to 1.6 Gbps (Cat 19) and uplink speeds of up to 150 Mbps.
In comparison, the Apple iPhone Xs Max uses the Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in the downlink (Cat 16) and up to 225 Mbps in the uplink (Cat 15).
Intel said the XMM7660 modem uses a 14 nm process node, the same as last year's XMM7560 process node.
This may be the last time we see Intel's mobile chipsets in the iPhone, as Intel has officially exited the mobile business.
This change is bittersweet, as we can now look forward to the possibility of seeing Apple-designed modems in the future.
Regardless, we expect Qualcomm modems to appear in next year's iPhones.
We'll have to wait and see if Apple launches iPhone 4G and iPhone 5G next year.
The Intel PMB5765 is identified as an RF transceiver for use with Intel modems.
Intel PMB6840, Apple 343S00355 (APL1092), which should be Apple's own main PMIC designed for A13 Bionic, Apple 338S00510, Texas Instruments TPS61280 battery DC/DC converter, STMicroelectronics STB601, Texas Instruments SN2611A0 battery charger, Samsung S2DOS23 display power management, etc.
The USI module shown below most likely contains the Apple U1 chip.
Apple claims its U1 chip uses UWB technology to improve spatial awareness, allowing the iPhone 11 Pro to understand its precise location relative to other nearby U1-equipped Apple devices.
We look forward to hearing more about the capabilities and use cases of Apple's U1 chip.
And, with all the hype surrounding home IoT, we imagine TechInsights isn't the only company interested in the chip.
So far, we know that the unlicensed UWB transmissions in Apple's iPhones are on two different frequencies - 6.24 GHz and 8.2368 GHz.
It's worth mentioning: U1 chips can only communicate with other U1 chips.
Therefore, we expect to see more U1s in upcoming Apple products.
It will be very interesting if Apple can include a U1 chip in the Apple Watch Series 5.
UWB and indoor tracking are not a new concept and have been on Apple's agenda since the first iPhone.
Other companies have UWB as well, for example TechInsights analyzed the Estimote UWB Beacons back in January 2018.
These beacons use DecaWave UWB transceivers to accurately locate other beacons and tags.
For more information on Estimote Beacon UWB and Estimote LTE Beacons, check out our different reports on these parts listed here.
TechInsights previously completed a basic floorplan analysis of the Decawave DW1000 UWB Radio IC as part of its IoT SoC subscription, covering Bluetooth, Wi-Fi, ZigBee, LTE-M/NB-IoT, LoRa, Sigfox, NFC, GNSS, UWB, and more.
In our iPhone 11 Pro Max model, it has a Toshiba 512 GB NAND flash memory module.
Murata 339S00647.
We suspect the module will feature the Broadcom Wi-Fi 6 / BT 5.0 wireless combo IC BCM4375?
We’ll find out.
NXP wins again with the new SN200 NFC & SE module.
Update:
We discovered a new die in the NXP SN200, which is different from the SN100 used in last year's iPhone Xs/Xs Max/XR.
To our surprise, we found a new STPMB0 chip.
We think it is most likely a wireless charging receiver IC, which also means Broadcom lost the socket, just like we have seen Broadcom design wins in previous Apple iPhones.
Our investigation of the iPhone 11 and iPhone 11 Pro Max cameras is ongoing, and we summarize our findings for each in Table 1.
During the Apple Special Event in September, we heard about 100% focus pixels for the iPhone Wide-angle camera.
We expected this to be consistent with full-chip dual photodiode phase detection autofocus (PDAF), but we have preliminary findings that the camera shows a PDAF mode similar to the 2018 iPhone Wide-angle camera.
Ongoing analysis will determine if Apple has actually adopted a Dual PD mode as suggested by the 100% focus pixels.
If true, this would be the first use of Shielded + Dual PD PDAF that we have documented.
As expected, Sony remains the supplier of the four visual cameras in the iPhone 11 Pro Max.
STMicroelectronics has been using its global shutter infrared camera chip as the detector for the iPhone’s structured light-based FaceID system for three years.
Table 1:
Summary of preliminary findings for iPhone 11 and iPhone 11 Pro Max Camera
12MP rear wide-angle camera image sensor bare die image (filter removed)
12 MP rear-facing ultra-wide-angle camera image sensor die image (filter removed)
12 MP rear telephoto camera image sensor die image (filter removed)
12MP front camera image sensor die image (filter removed)
1.4 MP front infrared camera image sensor die image
Apple/Cirrus Logic 338S00509 audio codec and three 338S00411 audio amplifiers.
Qorvo QM81013 Envelope Tracker IC (likely).
Avago (Broadcom) AFEM-8100 front-end module, Skyworks SKY78221-17 front-end module, Skyworks SKY78223-17 front-end module, Skyworks SKY13797-19 PAM, etc.
STMicroelectronics ST33G1M2 MCU, NXP CBTL1612A1 DisplayPort multiplexer, Cypress CYPD2104 USB Type-C port controller.
We will continue our analysis of the Apple iPhone 11 Pro Max.
Check back another day for updates.
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