Memory loses its leading position in semiconductors, logic IC process takes its place

Latest update time：2015-03-23

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[Fan Zhongxing/Taipei report] In the past, memory has always played a leading role in semiconductor manufacturing processes. Not only did DRAM manufacturers take the lead in investing in the most advanced processes, but even TSMC (2303) and UMC (2303) used memory to train their most advanced processes. However, in recent years, the entire semiconductor industry has changed. The logic product process has surpassed memory in all aspects, and wafer foundries have also directly introduced logic products. Memory has stepped down from its position as the leader in wafer fab processes.

In the past, TSMC and UMC's most advanced processes all used memory to train their troops, and the yield was increased to a certain level before investing in logic products. TSMC has always used SRAM (Static Random Access Memory) for training, while UMC has used DRAM (Dynamic Random Access Memory). Even Samsung has given priority to mass production of DRAM and NAND Flash (storage flash memory). The
logic process is catching up quickly.

However, after 65 nanometers, the logic product process quickly caught up, and now the logic process has clearly surpassed memory. TSMC and Samsung's logic process has advanced to 14/16 nanometers, and 10 nanometers are also under development. UMC, which is slightly behind, has also used 28 nanometers. But in memory factories, Samsung and Toshiba have entered 20 nanometers, Micron and Inotera (3474) are just about to enter 20 nanometers, SK Hynix is preparing to enter 20 nanometers in the middle of the year, and Nanya (2408) and Powerchip are both at 30 nanometers. Wu Jin, general manager of Microdrive Technology, pointed out that Intel has been the exclusive leader in semiconductor process for several generations. Intel's products are all logic products. Other wafer fabs lack sufficient confidence in their own technology, so they have to use memory to train their troops, because the memory process is relatively simple, and the memory units inside can be quickly copied, which helps to quickly improve the yield rate. After several years of catching up, the technical capabilities of leading manufacturers have improved, and the process development speed has progressed rapidly. At present, there is no need to train their troops with memory, and they have enough confidence to directly introduce logic products.

Semiconductor industry executives said that this is related to the trend changes in the electronics industry in recent years. In the early years, Wintel led the PC market. Microsoft's Windows became more and more complex, and Intel's processors became faster and faster. Semiconductor manufacturers followed Intel. Products that require the latest process are DRAM, chipsets, and graphics chips, so DRAM will become the process leader.

Taiwan's main wafer factory process
Rapid rise of communication chips

However, tablet computers and smartphones broke the monopoly of Wintel, and the ARM platform, which was previously considered to be a streamlined instruction set, emerged. In addition, the iOS/Android system is also relatively simple, which has led to the rapid rise of communication chips. Now, they are only one generation away from Intel's x86 processors.

At the same time, the DRAM industry has experienced two major crashes in the past eight years. Manufacturers have been struggling to survive, and the improvement of process technology has slowed down in recent years. They are no longer actively investing in new factories. In addition, the demand for DRAM capacity has stopped growing since Windows 8, which will naturally allow the logic process to surpass it and it will no longer be the leader in semiconductor process technology.

Source: Apple Daily