Important Minutes | BIMS2016 Beijing International Microelectronics Symposium and China New Energy Automotive Electronics Summit Forum

Latest update time：2016-10-01

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This article is reproduced from Tianfeng Electronic Research, thanks to the author for his contribution.

Table of contents

* Beijing North Huachuang Microelectronics Equipment Co., Ltd. Integration Release Ceremony

* The establishment ceremony of China New Energy Automobile Electronics Industry Innovation and Development Alliance

Keynote Speech:

1. Zhou Zixue: Some insights on the development of integrated circuits

2. Ding Wenwu: Exploration of industrial funds in promoting the independent development of industries

3. Ye Tianchun: Development Trends and Countermeasures of Sensor Manufacturing Technology

4. Ju Long: Semiconductor Industry: New Global Pattern and China's Opportunities

5. Sheng Licheng: Development ideas for the integrated circuit industry in Beijing Economic and Technological Development Zone

6. Ding Huiwen: IMEC, from "Semiconductor+" to "China+"

7. Cao Kanyu: A landmark chapter in China's semiconductor industry: the rise of the memory industry

8. Ding Xianfeng: The Internet of Things meets artificial intelligence: the era of awakening of all things is coming

9. Zhao Zhao: Smart Cars and Sensors

10. Hu Mian: API---Risks and Opportunities of Automotive Connectivity

11. Zhang Jinfang: In-cell, AMOLED driver is the key opportunity for the success of China's panel driver chips

12. Zhao Jin: New interfaces for electronic products will boost the billion-dollar IC market

13. Andrew Peng: The impact of JEDEC standards on the memory industry

14. Yin Ying: Application of in-vehicle display technology in new energy vehicles

15. Wu Hanming: Challenges of technological development in the integrated circuit industry in the post-Moore era

16. Gu Jinxu: Beijing's measures to support the development of new energy automotive electronics industry

17. Cisong: How to use Moore's Law to solve the battery problem of electric vehicles

18. Chen Wei: Discussion on the development of independent innovation of body electronics industry

19. Dawei Chen: Assessment requirements and practices for automotive-grade integrated circuits

Beijing North Huachuang Microelectronics Equipment Co., Ltd. Integration Release Ceremony

The ceremony officially announced that the reorganization of Sevenstar Electronics and Northern Microelectronics was completed, and that they would participate in global market competition under the brand of NAURA.

The integrated circuit industry is the core of the electronic information industry, and is also a strategic and basic industry to ensure national information security. One generation of equipment and materials determines one generation of industry. Whether the equipment and materials can be localized is the key factor in determining whether the industry is independent and controllable. The industrialization capability has evolved from mainly tracking to competing shoulder to shoulder with international manufacturers. The first domestically developed 12-inch 14-nanometer FinFET plasma silicon etcher marks a new breakthrough in China's integrated circuit equipment technology. In addition, the company is also actively expanding into the pan-semiconductor field, and has reached the domestic leading level in LED lighting, advanced packaging, MEMS, power semiconductors, compound semiconductors, new energy photovoltaics, flat panel displays, gas mass flow controllers and other fields, and its market share is at the forefront of the country.

The integration of the two equipment platforms was officially launched in the fourth quarter of last year, and strategic investors such as the National Integrated Circuit Industry Investment Fund were introduced. At the end of June this year, the approval of the China Securities Regulatory Commission was obtained, and asset restructuring and fund raising were completed, creating the only listed platform for integrated circuit equipment in China.

Beijing Electronics Control owns three listed companies, namely BOE, Sevenstar Electronics and Electronic City, as well as multiple industrial platforms such as Northern Microelectronics and Aiskai; with total assets of RMB 200 billion and sales revenue of RMB 60 billion from its main business, it will build a leading domestic platform for chip design, manufacturing, packaging and testing.

The founding ceremony of China New Energy Automobile Electronics Industry Innovation and Development Alliance

New energy vehicles have become a new driving force for the growth of microelectronics. It is predicted that in 2016, new energy vehicles will continue to grow by 20%, far exceeding other industries.

As far as China is concerned, in combination with 2025 and the integration of industrialization and information technology, new energy vehicles and intelligent connected vehicles have been listed as the top ten key development areas of high-end technology manufacturing.

The innovative development of automobiles mainly comes from the field of electronics. The core of automotive electronics is the control system. The application and combination of microelectronic systems and products in the automotive field is the carrier for the deep integration of information technology and the automotive industry.

With the development of mobile Internet, Internet of Things, big data, VR, and 5G, automotive electronics will become more intelligent, networked, and green. Safety, reliability, and interactivity will continue to improve, and will also become a new growth point.

1) New energy vehicles are the common focus of the smart security industry; 2) Integrate resources; 3) Adhere to the characteristics of military-civilian integration development and help industrial development; 4) Adhere to reform and innovation.

An industrial innovation and development alliance was established to jointly promote the development of new energy vehicles; the Ministry of Science and Technology included new energy vehicles and connected vehicles in the national major science and technology projects. A series of measures have promoted the rapid development of new energy vehicles.

Admittedly, in key links of the industry such as power batteries, battery management, motor control, sensors and vehicle control, there is still a certain gap between the product level and safety and reliability compared with the international level. It is urgent to integrate various resources and establish industry standards and specifications.

Some understandings on the development of integrated circuits

Chairman of SMIC Zhou Zixue

1. Post-Moore Era

I do not agree with the statement "later". Moore's Law is not a law, but a trend of industrial development. It has been repeatedly fulfilled and therefore worshipped before, but it is not very standardized. It has changed from one and a half years to two years, and now it has become three to four years. Moore's Law represents the continuous growth of high-tech industries, reflecting the trend of falling prices and rising functions.

I agree that, as integrated circuits have come to this day, 14nm FinFET is the real technology node. Once a breakthrough is made, it can bring at least three generations of technology. 10 and 7nm can still be made with FinFET technology. Therefore, from now on, 7nm is enough for the next five years, and there is no need to worry too much about technical details. However, after 7nm, this technology may not be the means, it may be EUV, which is not yet fully mature. Whether it will be successful depends on whether the yield and cost can replace the previous technology.

"No matter how the situation develops, integrated circuits can be made for at least 100 years!"

2. Build China’s semiconductor industry chain

1) If China has a complete IDM, then the industrial chain will be complete, and the world will only have Intel and Samsung, which occupy almost 50% of the CPU and memory product shares respectively.

2) OEM products are not powerful enough;

But we can confidently believe that we are now in the best period in history. Our current global share is only 5-7%, but we will soon take over 10% of the market in 3-5 years and will grow at a rate of more than 20% .

3) Without a strong manufacturing industry, there can be no complete industry, and there will be no room for growth of upstream materials and equipment. Under the premise that IDM cannot grow quickly, the importance of logic foundry becomes more and more prominent. It is difficult for equipment and material companies to occupy the original share in the international market, but if they are accompanied by the growth of domestic manufacturing in logic foundry, there will be great opportunities.

You must be patient when investing in the semiconductor industry.

3. Dispute over technical routes

Example 1: The battle between reduced instructions and complex instructions

IBM took the route of streamlined instructions, while INTEL took the route of complex instructions. One explanation is that if you follow the leading companies closely, you will easily fall into the intellectual property trap. Later, Intel and Microsoft formed the WIN-TEL system, which led the market for 30 years. Until the rise of mobile phones and tablets.

Example 2: The dispute over technology. When it came to the 14nm process, IBM sold the manufacturing to Global Foundry and there was no more dispute.

Example 3: The FinFET controversy has certainly become mainstream now, but it is likely to be integrated with other technologies in the future.

Conclusion: Advantageous enterprises are the main body that defines technology, products and markets. There are no such enterprises in China at present. Once an enterprise reaches this step, it can truly show the strength of China in this industry.

Exploration of industrial funds in promoting independent industrial development

Ding Wenwu, General Manager of National Integrated Circuit Industry Fund

1. Development of the integrated circuit industry in the first half of the year

According to WSTS statistics, global semiconductor market sales in the first half of 2016 were US$157.4 billion, a year-on-year decrease of 5.8%.

According to statistics from the China Semiconductor Industry Association, sales of China's integrated circuit industry in the first half of 2016 were 184.71 billion yuan, a year-on-year increase of 16.1% , a slight decrease of 0.4% from the first quarter.

Sales and growth of China's integrated circuit industry in the first half of 2016

The IC industry is mainly import-based. According to customs statistics, China imported 153.88 billion integrated circuits in the first half of 2016, a year-on-year increase of 6.9%; the import value was US$100.59 billion, a year-on-year decrease of 2.3%. China exported 83.92 billion integrated circuits, a year-on-year increase of 2.1%; the export value was US$29.6 billion, a year-on-year increase of 2.8%.

2. Industrial funds promote the independent development of the IC industry

1. Investment progress of major international funds

In the two years since its establishment, it has decided to invest in 37 projects and 27 enterprises, with a cumulative committed investment of more than 68.3 billion yuan and actual investment of more than 36 billion yuan.

The implemented projects cover all aspects including integrated circuit design, manufacturing, packaging and testing, equipment, materials, and ecological construction, achieving a complete layout in the industrial chain.

National large fund investment enterprise

Investment results of the National Fund

The fund focuses on supporting the best and strongest enterprises, and the invested enterprises are operating well;

SMIC's 28nm advanced manufacturing process entered mass production;

Spreadtrum Technologies entered the top ten design companies in the world for the first time;

Changdian Technology ranks fourth in the global packaging and testing industry;

SMIC's etching equipment entered the advanced process production line;

In the entire IC industry chain invested in, investment in manufacturing has exceeded 60%;

The industrial agglomeration development effect is obvious, with the investment in Beijing, Shanghai, Jiangsu and Shenzhen accounting for 80% of the total investment;

In terms of policy synergy, the investment amount of projects supported in collaboration with major national science and technology projects accounted for 68%;

With capital as a link, it has guided major pan-semiconductor companies such as BOE, Tsinghua Unigroup, Poly, and Sanan to enter the integrated circuit industry, injecting important new forces into the entire industry;

Fund investment has greatly leveraged the enthusiasm of domestic and foreign funds to invest in my country's integrated circuit industry, directly driving new social investment and financing of more than 150 billion yuan. The industry's financing environment has improved significantly, which is conducive to boosting my country's confidence in developing a safe and reliable integrated circuit industry.

2. Pay attention to industrial policies and emerging hot spots

Industrial policies: the 13th Five-Year Plan, the IC Promotion Outline, Made in China 2025, the "Internet +" strategy, the big data strategy, special construction funds, IC production layout planning, etc.;

Emerging hotspots: cloud computing, big data, Internet of Things, Internet of Vehicles, Industrial Internet, wearables, Zhienneng manufacturing, new energy vehicles, industrial control, smart grid, smart application series, 5G, etc.; AI: smart hardware, robots, drones, smart cars, VR/AR, etc.

3. Use the “Fund +” approach to achieve concentration

Planning the second phase of the National Big Fund: Ensuring sustainable development of the industry

3. Some thoughts

1. Thoughts on the IC production line during the 13th Five-Year Plan period

Advanced technology: 28nm, 14/16nm, R&D of 10nm; R&D of special technology; Storage chip: 3D NAND FLASH, DRAM; Compound semiconductor: GaN, SiC, R&D of AlN, SiN, C

2. Thoughts on M&A in the semiconductor industry

In 2015, there were frequent mergers and acquisitions in the international semiconductor industry, and the scale of mergers and acquisitions was unprecedented. In 2015, global semiconductor merger and acquisition investment reached US$120 billion, with China reaching US$7 billion and China reaching US$6 billion. (In July this year, Japan's SoftBank Group announced the acquisition of ARM for US$32 billion).

my country's ability to participate in international mergers and acquisitions is constantly improving, but it currently lacks acquisition entities with strong economic and technological strength and international operation experience. It is recommended that we treat and participate in international merger and acquisition projects rationally.

3. Focus on the work of China's high-end chip alliance

• The “China High-end Chip Alliance” was officially established on July 31, 2016.

• The alliance was jointly initiated by 27 key backbone enterprises, famous universities and research institutes in the high-end chip, basic software, and complete machine application industry chains.

• Category: CPU, FPGA, MEMORY, AD/DA, sensor MEMS, etc.

• The purpose is to build an industrial ecological system of "architecture-chip-software-complete machine-system-information service" around the high-end chip field and promote the rapid development of the integrated circuit industry.

Development Trends and Countermeasures of Sensor Manufacturing Technology

Ye Tianchun, Director of the Institute of Microelectronics, Chinese Academy of Sciences

There are many applications in existing mobile phones, such as sensors in iPhones and sensors in cars. Now the entire MEMS industry is in the rising stage. Its important features are systematization, integration and scale.

Multifunctional perception will become stronger and stronger in the field of Internet of Things, and the chip and manufacturing industries will have great development prospects. At present, automotive communications is definitely a focus, and other aspects include wearables, consumption, and home.

The most important thing in automatically sensing information and then transmitting it is the sensor. The application of sensing will be different from the previous informatization. Artificial intelligence will become a new trend in processing and application in the future.

The scale of the sensor industry has increased from hundreds of billions to trillions, which is a bit exaggerated; however, the applications of the Internet of Things in various industries, including wearables, smart robots, home, health, etc., may add up to trillions of dollars.

Current status of China's sensor industry

In terms of market size, China exceeded 40 billion in 2016. China has been developing this since the 1990s, and later on, corresponding plans were also being supported.

We are just starting out, and our performance in integrating industry, academia and research, and moving from R&D to industrialization is not very good. Our production is weak and our scale is small, but there is still room for improvement in the future.

Sensor Technology Development Trends

In the long run, we need to look at the development trend of sensors; among them, Moore's Law has been mentioned all the time, but we should not only see the slowdown of Moore's Law, but also pay attention to the development and driving role of system integration , which must be paid attention to.

The integration of MEMS and IC will be an important technology for the future development of sensor technology; the design environment and process must be integrated and compatible. Some design tools are being developed now, and there are opportunities for tool business in the next step. There is also development now, but it is still far from enough. This trend is mainly reflected in:

1) Integration of design environment and tools: Optimization and integration of MEMS and IC EDA tool design environments.

2) Integration of model expression and simulation: MEMS models tend to be expressed in the same way as ICs

3) Design for testability integration: Introducing wafer-level on-chip testing

4) Process integration compatibility: process integration, packaging integration, monolithic chip-to-chip integration 3D or TSV

The benefits of this fusion technology:

1) Under one platform process, realize the collaborative integration from design, modeling, simulation to verification.

2) The integration of MEMS+IC can greatly improve the simulability of the complete system.

3) Greatly save research costs and shorten research cycle.

4) Improve product competitiveness

There should be a link between design companies and foundries, and it is very important to standardize the models and integrate them into the design. If MEMS and IC are integrated, what will happen to these designs? This may become a bottleneck in the future. Of course, this also brings us some opportunities in technological innovation and entrepreneurship.

Another trend is that sensor manufacturing technology is gradually shifting to a foundry model. MEMS is no longer a one device = one process = one package model, but has entered a new era of separation of design and foundry. A sensor is a process, which can only be a product of a small workshop. Too personalized products consume a lot of energy. Therefore, in the future, sensors must solve this problem- standardization of processes .

After decades of development, the time it takes for MEMS products to go from research and development to commercialization is no longer what it used to be. In the 1960s, it took 21 years to commercialize pressure sensors, but now it only takes 11 years for MEMS oscillators to be commercialized.

The widespread use of mobile Internet has promoted the development of sensors towards low energy consumption and intelligence. Market size driving factors: typical mobile Internet of Things such as intelligent transportation, emergency response, and health monitoring; Challenges: new challenges in mobile terminals, mobile access, location-based mobile data processing, typical applications, and demonstrations.

Thinking about the development of the sensor industry: Aiming at future needs, the key directions are as follows:

1) Make every effort to develop integrated intelligent micro-nano sensor design technology, founder modeling technology and design technology

2) Develop low-cost, scalable manufacturing technology

3) Develop low-cost packaging and heterogeneous integration technologies

4) Develop reliability technology and reliability evaluation technology

5) Develop low-function wireless sensor technology

6) Solve the design and manufacturing standardization and specification of sensors

7) Develop large-scale and wide-ranging application products and application systems

8) Build a number of public technology platforms and bases to support the development of sensor technology

9) Develop multi-sensor integration and data fusion technology to realize sensor information fusion and software technology chip

Semiconductor Industry: New Global Landscape and China's Opportunities

Ju Long, Global Vice President and President of SEMI China

1. The semiconductor industry is maturing, and the global M&A wave is surging

1. The growth rate of semiconductor market slowed down:

Terminal products: PC - mobile phone - mobile computing, IoT; chip production capacity grows slowly.

TSMC's investment far exceeds that of other foundries

2. The global semiconductor industry is becoming more and more concentrated :

The top 10 semiconductor companies in the world in 2015 are Intel, Samsung, TSMC, Hynix, Qualcomm, Micron, Texas Instruments, Broadcom, Toshiba, and Avago.

Sales: The top 20 companies account for more than 70%;

Investment: Top 5 account for 60%

R&D: The number of companies with R&D expenditure exceeding US$1 billion increased to 12, with a total of US$52.87 billion, accounting for 81% of global R&D expenditure.

3. Demand in major application markets (PC/NB/SmartPhone) is generally stable: 2014-2019 CAGR: 2.5%

4. Global M&A value has set a new record , with M&A exceeding US$210 billion since 2016.

2. System vendors take the lead in promoting IC design development

Apple's investment and acquisition in the IC field

3. New applications, new models, innovations and opportunities such as the Internet of Things and AI

Smartphone market trends: Huge volume, steady growth

MEMS explodes with smartphones

In-vehicle electronics is growing rapidly

The development of the Internet of Things will drive new demand in the semiconductor market

IBM's neuron-like human brain chip breaks the von Neumann system

4. Process technology of integrated circuits: Moore's Law is slowing down, but it is still moving forward, and the MTM post-Moore era is flourishing

Manufacturing technology continues to advance

New semiconductors bring new material requirements

Multi-dimensional packaging trend

More than Moore: MEMS/Sensor Products

5. Changing Storage Landscape

NAND Flash market will grow significantly

SSD demand is the main driving force for the NAND market

Storage presents a new pattern:

6. Global Industry Landscape and China Trends

The global semiconductor industry is moving eastward : Europe, the United States, Japan, South Korea, Taiwan, and mainland China

Global electronics manufacturing industry transfer : Europe, America, Japan - Southeast Asia English-speaking countries - Taiwan, coastal areas of mainland China

Wafer: 200mm production capacity rebounds --- bringing opportunities to China's semiconductor industry

Global production capacity change trend from 2015 to 2018: China has the fastest growth, while Japan has negative growth

7. Opportunities in China’s semiconductor equipment and materials

Semiconductor equipment and materials industry: Raw materials and supporting equipment: US$43.4 billion; equipment: US$36.7 billion

This year, most of the equipment investment is used for technology upgrades

Foundries and storage are the main investment targets

Wafer manufacturing equipment: The United States, Japan, and Europe are the three major players - domestic equipment enters the market (North China Huachuang)

China's semiconductor industry has made amazing progress in the past 10 years. To advance the outline, a large fund is necessary.

Development ideas of integrated circuit industry in Beijing Economic and Technological Development Zone

Sheng Licheng, deputy director of the Beijing Economic and Technological Development Zone Management Committee

After years of development, Beijing Economic and Technological Development Zone has formed a complete integrated circuit industry chain led by SMIC, integrating packaging and testing, equipment, components and materials, and design companies; the scale of the development zone's integrated circuit industry has accounted for 1/2 of the city's total; and a highly competitive industrial application ecosystem has been formed in the fields of digital television, flat panel displays, mobile communications, smart phones, cloud computing, etc.

In terms of overseas mergers and acquisitions, we actively create a global layout, organize funds to carry out overseas project mergers and acquisitions, and introduce advanced projects and technologies in the integrated circuit and high-end equipment industries.

In 2015, the company invested RMB 2.4 billion in mergers and acquisitions, involving assets worth RMB 54 billion. It successfully acquired ISSI, OmniVision Technologies (OV), Mattson Equipment Corporation and Sweden's Silex (MEMS wafer foundry).

The development zone strengthens cooperation with leading domestic and foreign companies, promotes international mergers and acquisitions , and comprehensively breaks the long-term dependence on imports for major products such as mobile communication baseband/RF chips, memory chips, IGBT/power electronics/liquid crystal driver chips, CPU chips, and MEMS sensor chips, providing strategic support for national information consumption and information security.

The development goal is to build a world-leading R& D and manufacturing center in four high-tech fields by 2025: advanced new memory, baseband chips and radio frequency circuits, power electronics and power devices, and integrated circuit foundry and equipment .

IMEC, from "Semiconductor+" to "China+"

Ding Huiwen, General Manager of IMEC China, Belgium

IMEC is the world's leading semiconductor nano-microelectronics technology research center, founded in 1984, and is an independent, non-profit organization. IMEC connects university achievements and industrial needs, and has government support. Features: It can achieve from open research projects to one-to-one product development.

The arrival of the "semiconductor +" era:

More and more high-tech companies are developing vertically and entering the semiconductor industry. Semiconductors have become the core competitiveness of high-tech companies, and the semiconductor era has arrived.

Reason---cost strategy & differentiation strategy.

China has become a major consumer of semiconductor chips:

China has multiple levels of market demand, which lowers the entry barriers for IC companies;

The huge vitality of the local electronics industry has put forward innovative requirements for the IC industry;

Central and government support

A landmark chapter in China's semiconductor industry: the rise of the memory industry

Cao Kanyu, GigaDevice

Memory industry: rapid progress

1. Introduction to the memory industry

Memory is the supporting technology of modern electronic devices. Taking NAND flash memory as an example, each user may use 10 trillion storage units of information every day.

For mobile terminals, the cost of memory exceeds that of CPU; for personal computers, the speed and power consumption of storage are gradually becoming bottlenecks; for servers, performance is determined by the performance of memory; and for data centers, storage is the largest source of energy consumption.

In 2015, global memory sales reached US$77.2 billion, accounting for 23% of global semiconductor sales.

Trend 1: Memory usage is becoming more diversified

Trend 2: Suppliers are gradually consolidating and entering an era of oligopoly; the main DRAM suppliers are consolidated into three companies that account for more than 90% of the market: Samsung, SK Hynix, and Micron.

Trend 3: Stable capital and R&D alliances have emerged among mainstream suppliers; stable business alliances have emerged, such as Intel and Micron, Toshiba and Western Digital

Trend 4: Rapid Expansion of Expenditure on New State-of-the-Art Factory Equipment

Trend 5: Memory technology becomes three-dimensional

Trend 6: China's storage industry is taking shape

2. Current status and opportunities of China's memory market

Memory chips are the largest category in China's chip market.

China's DRAM chip consumption accounts for 22% of the world's total, and its NAND flash memory chip consumption accounts for 29% of the world's total. Compared with the annual memory chip consumption of about US$20 billion, the memory chip turnover of Chinese domestic manufacturers is less than 1%.

In the 2015 world ranking of flash memory manufacturers, GigaDevice ranked tenth with a market share of 0.7%.

3. Trillion Innovation

In 2005, the company launched SRAM chip products, in 2008, it launched China's first independently designed SPI NOR flash memory chip, in 2013, it launched China's first Cortex-M3 32-bit MCU, and in 2015, it mass-produced China's first independently designed NAND flash memory chip. It ranks third in the international SPI NOR market and first in the SPI NAND market, and has obtained more than 190 patents.

NAND flash memory chips are being used in automotive-grade applications, and we hope to achieve good results in automotive electronics.

NOR: Surpassing the previous two companies

New memory has been in the spotlight for a year

Focus on development:

1) NAND flash memory

2) MCU

3) eMMC/Emcp

From a market perspective, we are more optimistic about the market opportunities in 2D NAND because the market demand is very stable. However, international manufacturers are turning to 3D NAND, which is a good opportunity for us.

The Internet of Things meets artificial intelligence: the era of awakening of all things is coming

Ding Xianfeng, Chief Scientist of Huawei Sensors

Only through scene recognition and situational awareness can natural human-computer interaction be achieved and consumers can experience the correct path of artificial intelligence in the era of the Internet of Things.

Preface: Wisdom brings us back to childhood. --- Blaise Pascal, Pensees

Artificial intelligence research has achieved a series of milestones, but in terms of the key issue of understanding the essence of intelligence, there is still a lack of breakthrough progress, which limits the development of artificial intelligence. The development trend of AI is from computational intelligence, perceptual intelligence to cognitive intelligence. The essence of artificial intelligence is the ability to adapt under conditions of relatively insufficient knowledge and resources.

Cloud computing is a $2.3 trillion market.

The sensors in mobile phones are designed to sense the owner and help the owner better interact with the machine and the environment.

MEMS has huge value in mobile devices. All antenna modems are inseparable from MEMS, including microphones, speakers, lenses, etc.

Sensors are a common thread from aircraft to robots. Self-driving cars, drones, and robots are very similar to the perception and cognitive systems in fighter jets.

Wearable devices attempt to understand people's vital signs and then develop corresponding exercise and health plans, and the market space is huge.

Smart cars and sensors

President of Xinfu Microelectronics, Zhao Zhao

1. Autonomous driving is the core application of smart cars, and its overall development is divided into three stages:

1) ADAS Advanced Driver Assistance System

2) Autopilot

3) Driverless cars

2. Background of smart sensors:

Smart sensors use mature integrated circuit technology and equipment to build a whole new system architecture, namely iMEMS (integrated MEMS), which integrates sensors, control, and transmission into a single chip.

3. SOS system and sensors

4. Innovative sensors for smart cars:

1) Infrared thermal imaging sensor---safe driving

2) 3D laser video radar chip---precise driving

3) HUD laser projection chip---assisted driving

4) Multi-grinding bioelectric sensor---health monitoring

API---Risks and opportunities of car connectivity

Hu Mian, Director of APIM Solutions, CA Technologies Greater China

CA Solutions: Agile Management, DevOps, Security

Internet driving technology has been developing continuously in recent years, and the car-connected market is expected to reach US$98 billion in 2018. New car brands have taken this technology as a selling point and development focus, which has accelerated the demand for technology and the speed of development.

Since 2015, security issues related to the Internet of Vehicles have been gaining public attention. The problem is confusion:

1) Poor visibility and controllability;

2) Poor security;

3) Lack of data and services, APP shifts, and slow implementation of new features;

This model is unsustainable for the development of the Internet of Vehicles, the Internet of Things, and the automotive ecosystem; and SSL, encryption, firewalls, vulnerability scanning, etc. cannot solve the problem of chaos.

Another role that Internet technology brings to the automotive industry is the new business model that may be brought about by the capability opening platform, big data and new ecosystems, such as UBI. Through the development portal, APIs are opened, developers are managed, and APP applications are analyzed.

In-cell, AMOLED driver is the key opportunity for the success of China's panel driver chips

President of Chiptron North, Zhang Jinfang

Smartphone display trends: In the past few years, the size has continued to increase and the resolution has continued to increase, but after 2014, there has been almost no progress.

Next generation mobile display technology:

1) Thin and light, improved screen quality, low cost --- Incell display

2) Extreme black, vivid display, higher contrast --- AMOLED display

BOE achieved mass production of Incell mobile phone display panels in the first half of 2016, and started to produce mobile phone display panels in Chongqing 8.5-generation line in Q4 2016; Tianma achieved mass production of Incell mobile phone display panels in the first half of 2016, and started mass production in Shanghai 5.5-generation line and Wuhan 6-generation line in 2017. Huaxing Optoelectronics started mass production of Incell and general low-temperature polysilicon mobile phone panels in the second half of 2016, and the production capacity of Wuhan 5.5-generation line was fully opened in 2017. In Q3 2017, BOE, Tianma and Huaxing Optoelectronics will produce about 50kk mobile phone panels per month, which also means that Chinese panel factories need 50kk touch display integrated chips per month.

Chinese smartphones (the world's top ten) accounted for more than 30% of the market share in 2016 ; Chinese panel manufacturers have a 36% market share: Samsung has completely switched to AMOLED and launched TF-LCD, and most Chinese manufacturers are planning both technologies.

New interfaces for electronic products will boost the billion-dollar IC market

Jin Zhao, Vice President of Fairchild Semiconductor

In 2015, Google and Apple first unified the power port, USB port, DP port, HDMI port and VGA port into the USB Type-C port on laptops.

USB Type-C Connector:

1) Better user experience: smart interface, support for reversible insertion

2) Higher speed, up to 10Gps

3) Higher definition, 4k Display

4) Higher power, 100W

5) More data interfaces

Electronic interfaces can be unified: USB Connectors, VGA, DVI, HDMI, and DP are all transformed into USB Type-C and PD; achieving unified connection for charging, data, video, and audio.

According to HIS market forecast, the PC penetration rate of USB Type-C is expected to reach 80% and the mobile phone penetration rate will reach 50% in 2019. More than 2 billion devices will use USB Type-C, which will create a multi-billion semiconductor market.

The impact of JEDEC standards on the memory industry

Andrew Peng, Chief Strategy Officer of Tongfu Microelectronics

Consistency is critical to industry development, and relevant standards must stay ahead of technology.

JEDEC is the global leader in developing and formulating standards for the microelectronics industry, with a multinational membership.

JEDEC Guidelines:

Promote rapid open standards; one company one vote; only interested companies vote; manage standards containing intellectual property through effective patent policies; adhere to antitrust principles.

Standards are beneficial to every entity. Memory standards lead the industry. Industry development requires JEDEC standards. Flash standards follow DRAM practices. JEDEC leads the formulation of standards for all memories.

Application of in-vehicle display technology in new energy vehicles

Yin Ying, Assistant Director of BAIC New Energy Engineering Research Institute

In 2015, BAIC Group achieved vehicle sales of 2.489 million units, leading the industry in growth rate.

In-vehicle display technology: 17-inch large screen, integrated control, interconnection, and brilliant display.

Liquid crystal display is the "main battlefield" of new energy vehicle display technology in the future; LCD vehicle display technology based on the following characteristics is a manifestation of strength and technology. Liquid crystal display LCD has large screen, multiple screens, flexible screen, high resolution, high display effect, etc. Vehicle display technology will also cooperate deeply with core devices and core algorithms.

Challenges of technology development in the post-Moore era for the integrated circuit industry

President of Canxin Microelectronics and Advisor of SMIC

Wu Hanming

1. Integrated Circuit Industry Background: Strategic, Basic, and Leading

Three major challenges:

1) Double pressure from strategic constraints and market competition: Strategy requires technology and equipment, and industry requires core patent protection

2) The combination of physical precision and engineering super-largeness in the manufacturing process

3) Challenges to the integrity of the industrial chain ecosystem

2. Moore’s Law:

When the price remains unchanged, the number of components that can be accommodated on an integrated circuit will double approximately every 18-24 months, and the performance will also double; later Moore revised it to: the number of transistors on a chip per unit area can double every two years.

3. Five major challenges in chip manufacturing process technology:

1) Graphics Technology

2) New materials

3) Process error

4) New structure: new device design, manufacturability issues, key processes for large-scale production

5) Process integration: yield requirements, product reliability, process window, etc.

4. The characteristics of post-Moore's Law: the price of a single transistor has stopped falling and is even rising as the process improves.

After more than 50 years of miniaturization, transistors may stop shrinking in just five years.

Those were happy days before 22nm, but after 16nm, the only support was basically FinFET.

Foundry takes economic considerations into account and has already adopted a horizontal manufacturing process, rather than competing head-on with Intel.

5. my country’s forecast:

In 1992, it was predicted that " Moore's Law will become invalid in 2014-2017, but silicon microelectronics still have a long life and will not exit the mainstream until 2047. "

6. Cost trend of integrated circuit industry development:

The increase in design costs from 32nm to 16nm exceeds $100 million, typically requiring more than 100 million die, or at least a $1 billion market, to justify the investment.

7. Technological Prospects in the Post-Moore Era

The four great inventions of CMOS devices are all basic research results of universities and research institutes 16 years ago

1) 3D Transistor (FinFET)

2) HKMG high dielectric constant and metal gate

3) Strained Si

4) Raised S/D source and drain

8. The way out in the post-Moore era

1) Fundamentally change the chip design: CMOS extension is the most promising

2) Finding alternatives to silicon materials: EUV will be the mainstream in the future

3) Finding a way out for existing transistors: multi-core chips, specialized chips, and new types of chips

For example, 3D chips stack memory on top of the processing logic layer, but there are three major challenges: heat dissipation, connection, and 2D materials.

9. Conclusion and Recommendations

1) Strengthen investment in basic research

2) Attach importance to IP: It is a bridge between design and manufacturing, and the IP public platform supports mass innovation.

Moore's Law may end, but innovation will never end!

Beijing's measures to support the development of new energy automotive electronics industry

Gu Jinxu, Director of the Electronics Department of Beijing Municipal Commission of Economy and Information Technology

In the past, the protection of the automotive industry restricted the development of automotive electronics, making it difficult to enter the front-end installation market; the new opportunity lies in the country's massive investment and support in the field of new energy vehicles.

1. Positioning of the new energy automotive electronics industry

The main lines of Beijing's industrial development:

1) New energy smart cars---solving urban traffic problems

2) Large Scale Integrated Circuits

3) New generation of mobile Internet

2. Beijing New Energy Vehicle Electronics Foundation

Institute of Microelectronics of the Chinese Academy of Sciences, SMIC, Datang Telecom, National Power Battery Innovation Center, etc.

3. Beijing’s new energy vehicle electronics development initiatives

1) Build a platform to gather Beijing’s industrial innovation resources through market-oriented means

2) Establish funds and innovate government funding support methods

3) Focus on projects and enhance innovation capabilities in key areas

4) Promote coordination, take advantage of Beijing’s technological advantages, and collaborate on innovation in the industrial chain

5) Build demonstrations and implement industrial demonstration applications

How to use Moore's Law to solve electric vehicle battery problems

Dr. Ci Song, Department of Electrical Engineering and Applied Technology, Tsinghua University

1. Lithium batteries are widely used in C-end electronic and electric power products, electricity, photovoltaics, wind power, electric and hybrid car lights.

The annual output of lithium batteries has reached new highs, but the safety issues exposed in their applications are becoming increasingly serious. The current shortcomings of the power battery industry mainly include the following:

1) Battery manufacturers have a cognitive misunderstanding of pursuing battery consistency. It is difficult to break through the energy density of battery materials, which requires breakthroughs in physics and material systems. There is a lack of technical means for cascade utilization;

2) At present, domestic BMS manufacturers "focus on protection and neglect prevention", lacking real-time dynamic and accurate battery pack status estimation and preventive balancing technology, resulting in capacity loss and efficiency problems;

3) Battery management chips are the core of battery management systems. Currently, their core technologies and products are mainly controlled by foreign manufacturers, resulting in the situation that domestic battery management system integrated solutions are subject to foreign manufacturers;

4) At present, the control chips of foreign battery management systems are all designed with fully customized application-specific integrated circuits (ASICs), which have a small number of channels, poor scalability, long R&D cycles, high costs, and lack of customization capabilities. System upgrades require redesign and tape-out, and cannot support the diverse needs of users.

2. How to deal with differences in battery cells

Traditional solutions (such as Tesla) - Avoid. Tesla's solution is a cell-level solution, which cannot completely avoid the differences between single cells and is too costly. Since there is no system-level mechanism to accommodate and manage the differences between single cells, the tiny differences at the cell level will gradually increase, leading to a system-level short board effect, the system capacity will gradually decrease, and the system performance will gradually deteriorate.

Instead, we choose to accept and manage the differences between single cells - by introducing system-level technologies that can shield the differences between single cells to address the weak points of the battery system; improving the granularity of time and space control, and reducing system complexity and cost through Moore's Law.

Core idea: Convert hard-wired system into program-controlled switch network switching system

3. Different ways to improve battery system safety

Tesla's solution: A drastic measure, welding a fuse to each battery. The problem is that if the fuse blows, the system capacity will be permanently damaged, and the connection of single batteries is an irreversible process.

What we are doing: Preventing problems before they arise. Due to the use of dynamically reconfigurable battery network technology, the physical connection between single cells is a dynamically reversible process. Therefore, once the current and temperature imbalance at the cell level occurs, it will be eliminated in time by the management and control system.

Discussion on the Development of Independent Innovation of Body Electronics Industry

Chen Wei, General Manager of Chongqing Jicheng Automotive Electronics Company of China Electronics Technology Group

Several major issues that OEMs are concerned about: quality, cost, service, and safety

Evolution of automotive electrical and electronic architecture (EEA): High degree of platformization is an inevitable trend in vehicle development

Fewer ECUs, more complexity, and more demand

Body control system: the key node of automobile intelligence

It has gone through the stages of decentralized, centralized, and distributed control and has evolved into a body domain control system.

Requirements and Practices for Automotive-Grade Integrated Circuit Assessment

Chen Dawei, Director of the Integrated Circuit Test and Verification Laboratory of China Electronics Standardization Institute

AEC is the Automotive Electronics Council, whose founding members are Adecco, Ford and Chrysler, and also includes Tier-1, Tier-2, partner and customer members.

AEC-Q100 is the minimum stress test requirement, which detects possible failures of devices through stress acceleration.

In China, the Fourth Institute of Electronics is currently responsible for SOC chip performance parameter testing and AEC-Q100 reliability verification.

my country's automotive components will refer to the military circuit system to establish general specifications for automotive chips, including automotive battery power management chips, ADAS chip general specifications, tire pressure chip general specifications, etc.

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