TSMC enters high-speed computing chip market
TSMC co-CEO and general manager Liu Deyin said yesterday (13) that the business opportunities for high-speed computing chips used in deep learning, high-end servers and data centers will surge in 2019 and become the main driving force for TSMC's next wave of growth, replacing smartphones.
Liu Deyin estimates that by 2020, the global market size of high-speed computing chips will reach US$15 billion. TSMC has a favorable position and is estimated to account for 25% of revenue.
In addition, the three major fields of artificial intelligence, smart cars and the Internet of Things will also show significant growth. Among them, the global Internet of Things market size is estimated to increase from US$2 billion this year to US$4 billion in 2020; the automotive electronics market size will also jump from US$4 billion this year to US$6 billion in five years.
He emphasized that the application chips related to these four major fields all require more advanced process support, which is also the main key for TSMC to accelerate the pace of process advancement in response to customer requirements.
Liu Deyin said that TSMC will not only achieve a high market share in the field of high-speed computing chips in 2019, but also outperform the industry's average growth rate by more than twice in the field of automotive semiconductors over the next five years.
This is the first time that Liu Deyin has released the market estimates for the next five years in these four fields, as well as TSMC's role and ambitions, after he first proposed at TSMC's annual supply chain management forum in May this year that artificial intelligence, smart cars, the Internet of Things, and high-speed computing chips are the four major driving forces of the semiconductor industry in the future. He also proposed more specific forecasts and challenge goals. TSMC previously estimated that smartphone-related application chip-related businesses accounted for more than half of its revenue in recent years. TSMC CFO He Limei added that the amount of revenue contributed by each high-end smartphone to TSMC was about US$9 last year, and this year it is estimated to increase to US$10.
This article is from Economic Daily. If it is reproduced inappropriately, please contact us in time for processing. Thank you.
[About reprinting]: Reprinting is limited to full text reprinting and the title and content of the article must be completely retained. No deletion or addition of content is allowed to circumvent the original protection, and the beginning of the article must indicate: Reprinted from the WeChat public account "Semiconductor Industry Observation icbank". Thank you for your cooperation!
【About submission】: Semiconductor elites are welcome to submit articles. Once accepted, they will be published with your name and rewarded with a red envelope! Please indicate "Submission" in the title of the manuscript email, and indicate your name, phone number, unit and position in the manuscript. Welcome to add my personal WeChat account MooreRen001 or send an email to jyzhang@moore.ren
Click to read the original text and join the Moore Elite
Featured Posts
- [DigiKey "Smart Manufacturing, Non-stop Happiness" Creative Competition] Unboxing
- IhavereceivedtheRaspberryPi4Bdevelopmentboardforthe"SmartManufacturing,Non-stopHappiness"creativecompetitionjointlyorganizedbyDigi-KeyElectronicsandEEForumforawhile.Thememoryisthe8GBversion.Ihavebeenbusywithp
- ly87802541 DigiKey Technology Zone
- A summary of the most downloaded electronic technical materials this week (2020.6.8~12)
- IhavecompiledthematerialsthatIdownloadedthemostthisweekforyourreference! ElectronicproductdesignEMCriskassessment:https://download.eeworld.com.cn/detail/tyw/301890 EMCelectromagneticcompatibilitydesignandtestcas
- 高进 Download Centre
- Body temperature detection and status call monitoring system
- summary ThissystemisbasedonRS485communicationnetwork,andrealizesmulti-nodeonlinetemperaturedetectionandstatuscall.Thesystemconsistsoftwoparts:theuppercomputer(mastercontrolstation)andthelower
- fish001 Analogue and Mixed Signal
- A troubleshooting example of connecting XDS100V3 debugging target board with CCS
- Recently,whenIusedCCStoconnectXDS100V3todebugCC1310,IfoundthatIcouldnotconnecttothetargetboard. ThefollowingerrorisreportedduringVerify: Executethecommand: %ccs_base%/common/uscif/dbgjtag-f%boarddatafile%-rv
- 火辣西米秀 DSP and ARM Processors
- 1kHz, 0dB test signal
- Isawaquestionlikethisonline,let'sseewhateveryonethinks:Q:WhentestingDVDandaudioequipment,atestsignalisusuallyused,a1kHz,0dBsignal.Whatisthespecificdefinitionofthissignal,whyisitusedasatestsignal?Howmuchi
- topwon Analog electronics
- SiC is more suitable for ZVS soft switching circuits! ——How to improve the efficiency of ZVS circuits
- WeknowthatthemaingoalofZVSistoswitchwhentheswitchingdevice(suchasMOSFETorIGBT)isinazerovoltagestate,therebyreducingswitchinglossesandgreatlyimprovingconversionefficiency.Butisthisenough?Obviously,westillwant
- okhxyyo Power technology