Opening next week! From Chiplet heterogeneous integration to SiP mass production solution, SiP and advanced packaging and testing blockbuster exhibition will be held in Shenzhen from November 6 to 8
As one of the major events in the global packaging and testing industry chain, the China System Level Packaging Conference and Exhibition (SiP China) was held at the same time as ELEXCON last year and the scene was very popular! The meeting was packed and it was hard to get a ticket! Now, the two major exhibitions have joined forces and will appear together again next week!
▲SiP China 2021 is packed with seats!
From November 6 to 8, 2022 , SiP China Shenzhen Station will once again be held concurrently with ELEXCON in Hall 1/9 of the Shenzhen Convention and Exhibition Center (Futian) , from IC design to packaging and testing manufacturing, creating a SiP full industry chain carnival! Pay attention to the latest developments in global SiP technology and packaging and testing industries. Chiplets, heterogeneous integration, 2.5D/3D IC, wafer-level SiP, AI empowerment and other topics will become hot topics at this conference!
Gathering 200+Fabless, 150+ high-quality companies in advanced equipment, packaging and testing services, EDA/IP, new materials and other fields
Big names from companies such as Amkor, ASE, Changdian, Tongfu Microelectronics, Yole, Heraeus, Huatian, Yuemo, Siemens EDA, Advantest, Xinrui Micro, and Jushi Technology will all appear on stage.
The 540㎡ "Wafer Level SiP Advanced Packaging Production Line" demonstrates the real production process on site
● Third Generation Semiconductor Power Devices and Packaging and Testing Technology Summit
● Mini/Micro LED Industry Development Conference
● The 3rd TWS&Wearable Key Technology Seminar
……
SiP China Shenzhen Station▼Visitor registration is in full swing
(Long press to identify the QR code to register for the visit)
In the post-Moore's Law era, the revolution in chip design methodology extends from the front-end to the back-end packaging and testing, breaking through the limits of PPA challenges! ELEXCON 2022 will bring together 200+ IC design companies , covering embedded processors/MCU, RISC-V area, storage area, embedded AI and FPGA, industrial computers/boards, 5G chips and communication modules, radio frequency technology, automotive grade Chips and components, power management chips, power devices, third-generation semiconductors, MEMS/sensors and other product lines will be displayed, from IC design to packaging and testing manufacturing, creating a SiP full industry chain event!
*Only some exhibitors, ranked in no particular order
In addition, a special pavilion for "SiP and Advanced Packaging and Testing" will be built on site , covering: SiP system-level packaging, wafer-level packaging and testing, OSAT packaging and testing services, 3D IC design/EDA/IP tools, semiconductor equipment and advanced processes , advanced materials and other new technological products and solutions, it will soon bring together more than 150+ participating brands in the packaging and testing industry:
*Only some exhibitors, ranked in no particular order
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