Moore's Elite Packaging Service: High Quality, Fast Delivery, High Cost-effectiveness

On August 27, Tang Chuan, Secretary of the Yubei District Committee of Chongqing, and Yang Man, Deputy District Mayor of the District Government, visited technology innovation enterprises including Moore Elite Chongqing Advanced Packaging Innovation Center in Xiantao International Big Data Valley . Secretary Tang Chuan emphasized that we should vigorously promote technological innovation, continuously create an innovative environment, vigorously develop the digital economy, and promote the deep integration of digital technology with economic and social development.

Moore Elite Chongqing Advanced Packaging Innovation Center, with an area of ​​nearly 3,000 square meters, mainly provides QFP/SOP/ceramic packaging/metal packaging engineering and small-scale production services. Based on the success of the first phase of Hefei Rapid Packaging Engineering Center (mainly QFN/BGA/LGA/SiP series products) which was fully operational and served nearly 500 customers, it has carried out differentiated technology layout and capacity expansion, and is committed to serving the needs of customers in the central and western regions and the whole country.

As a one-stop chip design and supply chain platform, Moore Elite mainly focuses on medium, small and micro chip design companies, providing three major businesses: quick sealing (engineering batch) business, mass production management business, and SiP business design. It makes up for the customers' lack of professional technology and operation team in packaging design, engineering, and quality, and helps customers optimize the level and management capabilities of technology, materials, quality, delivery time and cost in the packaging process to adapt to the diversified development direction of customers, support customers' market expansion, new product release, product delivery and development of listing progress, and at the same time help terminal companies (TCL, CRRC, Changhong, etc.) solve the needs of short, small and thin.

Moore Elite Chongqing Advanced Packaging Innovation Center

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Moore Elite Packaging Service Introduction:

Moore Elite Packaging Service Advantages:

The package types that can be produced cover the mainstream package types in the industry:

Moore Elite Advanced Packaging Base:

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Moore Elite is committed to "making it easy to make chips in China". With the three major business segments of "chip design cloud, supply chain cloud, and talent cloud", it connects the key links of chip design and wafer packaging and testing, improves efficiency, shortens cycles, and reduces risks, creating a one-stop platform for chip design and supply chain integration. Its customers cover 1,500 chip companies around the world.

The chip design cloud provides customers with turnkey full-process design services from chip definition to product, as well as IT/CAD and cloud computing services; the supply chain cloud provides customers with one-stop wafer flow, packaging, testing, product engineering and mass production management services; the talent cloud cultivates and supplies professional talents for the industry and helps IC talents to learn throughout their lives.

Moore Elite is headquartered in Shanghai, with branches in Hefei, Beijing, Shenzhen, Wuxi, Zhengzhou, Chongqing, Chengdu, Nanjing and other places, and overseas R&D centers in Dallas, Silicon Valley in the United States and Nice, France.