【Online】Registration starts! CadenceTECHTALK: Fast, accurate and comprehensive electromagnetic analysis with EMX Planar 3D Solver V6

Latest update time：2021-05-13

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Electromagnetic (EM) simulation is a critical step in modern analog chip design. As operating frequency and performance indicators increase, the limitations of traditional RC extraction tools become increasingly apparent. Through this online seminar, we will discuss Cadence EMX ^® Planar 3D Solver - the best-in-class electromagnetic simulation tool for silicon chip devices. Through this online seminar you will learn:

Why do you need electromagnetic simulation? EMX Planar 3D Solver is typically used for distributed layout devices that require highly accurate models. These structures include inductors, baluns, transformers, and transmission lines. Cadence will explain why traditional parasitic extraction tools cannot perform high-speed and accurate simulations of these structures and the basics of how the EMX Planar 3D Solver generates solutions.

How to use EMX Planar 3D Solver to optimally solve silicon wafer structures. EMX is able to handle complex PDK stack-ups and various metallization rules, and can mesh the internal metal to give the correct quality factor (Q) of the spiral inductor, which is difficult to accurately predict using traditional tools.

The latest features of the EMX Planar 3D Solver V6 version and integrated use in the Cadence Virtuoso ^® environment. Updates to the V6 version include support for multi-machine distributed computing as well as GUI simplification and new features.

Don't miss this opportunity! Hurry up and sign up for this online seminar to learn more about the EMX ^® Planar 3D Solver tool. We look forward to your arrival!

meeting time

May 25, 2021 (Tuesday)

14:00 – 15:00

Meeting form

Online seminar

The conference entrance will be sent to you after registration confirmation

the speech topic

Using EMX Planar 3D Solver V6

Perform fast, accurate and comprehensive electromagnetic analysis

Speaker

▶ Zhong Xiaohui, Sr Principal Application Engineer, Cadence

Mainly responsible for the technical promotion and support of Cadence MSA product line, familiar with multi-physics co-simulation analysis of chips, packages and systems, electromagnetic field solver, chip PDN modeling, I/O circuit modeling and system-level SI/PI analysis and Optimization and other aspects have been studied in depth.

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About Cadence

With more than 30 years of expertise in computing software, Cadence is a key leader in the electronic design industry. Based on the company's intelligent system design strategy, Cadence is committed to providing software, hardware and IP products to help electronic design concepts become reality. Cadence's customers are the most innovative companies around the world, delivering everything from chips and circuit boards to the most dynamic application markets such as consumer electronics, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and medical. Systematic excellence in electronics. Cadence has been ranked among Fortune magazine's 100 Best Companies to Work For for seven consecutive years. For more information, please visit the company's website at cadence.com.

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