AI: “I came from the future and have arrived now”
(Pictures from the Internet)
Last week, the 2018 World Artificial Intelligence Conference was grandly held in Shanghai with the theme of "Artificial Intelligence Empowers the New Era" . The most influential scientists and entrepreneurs in the field of artificial intelligence in the world gathered here for high-end dialogues, interpreting the "Chinese solution" and "world wisdom" with the most authoritative views and consensus.
Industry leaders agree that big data resources will be used by more people, and AI application scenarios will become more diverse in the future. The AI revolution requires industry cooperation to promote the sustainable development of society.
However, while paying attention to the prosperity that artificial intelligence brings to the entire industry, we should also see beyond the phenomenon that
the combination of artificial intelligence and big data requires innovation in terminals and cloud computing
. Artificial intelligence requires higher-performance processors and larger memory. From materials to equipment and systems, our industry will need new breakthroughs.
(Photo of Mr. Yu Dinglu of Applied Materials giving a speech)
Focusing on the industry's path forward in the post-Moore's Law era, Yu Dinglu, Group Vice President of Applied Materials, Cross-Regional General Manager of Global Semiconductor Business Services Group, and President of Applied Materials China , delivered a speech entitled "Driving the Artificial Intelligence Era with Material Innovation" at this conference .
(Photo of Mr. Yu Dinglu of Applied Materials giving a speech)
“AI is our biggest opportunity to date, both strategically and economically. New chip architectures, new structures within chips, new materials, new ways to shrink chips, and new ways to interconnect chips using advanced packaging technologies all require technological innovations in materials engineering . We need to establish new industry rules to drive the connectivity and speed of the entire industry ecosystem.”
“ Unleashing the full potential of AI requires a 1,000x improvement in compute performance per watt. This is a number we hear repeatedly in our conversations with leading AI companies.”
(Photo of Mr. Yu Dinglu of Applied Materials giving a speech)
“The development of artificial intelligence requires a large amount of low-cost, high-performance, and low-power data storage space. At the same time, high-performance computing requires more optimized performance, energy efficiency, and cost.”
(Photo of Mr. Yu Dinglu of Applied Materials giving a speech)
"In the past, Moore's Law scaling was used to optimize performance, power, and area cost (PPAC * ) advantages in parallel. It combined 2D scaling to shrink the chip and materials engineering to improve transistor and interconnect performance. In the future, PPAC innovation will be driven by five factors: new chip architectures, new structures within the chip including 3D, new materials, new chip size reduction methods, and new chip interconnect methods using advanced packaging technology. The foundation of all of the above is materials engineering ."
**PPAC: performance, power, area-cost
From a spark to a raging fire,
At present, the wave of artificial intelligence is sweeping the world.
The world you once imagined changing is being changed.
The future is here.
This is a wonderful show brought about by technological progress and human innovation!
Welcome to leave a message and share your vision.
Join us in imagining a new era empowered by artificial intelligence.
About Applied Materials
Applied Materials, Inc. (NASDAQ: AMAT) is a leader in materials engineering solutions that power nearly every new chip and advanced display produced worldwide. With technologies that can transform materials at the atomic level at scale, we enable our customers to realize what’s possible. Applied Materials believes that our innovations will drive the advanced science of the future. For more information, please visit:
www.appliedmaterials.com 。
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