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Daily Core News
Issue
0302
❶Intel
’s 1nm process will be put into production/development by the end of 2027
Intel's latest wafer foundry blueprint shows that Intel 10A (1nm process) will be put into production/development (non-mass production) at the end of 2027, marking the arrival of the company's first 1nm node; Intel 14A (1.4nm) node will be in 2026 put into production annually. The company is also committed to building a fully autonomous AI-driven wafer fab. (Tom's Hardware)
❷Hesai
Technology and Great Wall Motors have reached a strategic cooperation to jointly promote the research and development of multiple lidar projects
Recently, Hesai Technology and Great Wall Motors reached a consensus on mass production cooperation of high-performance lidar, and will carry out technical cooperation and upgrade based on the existing AT128 lidar fixed point. Many new passenger models of Great Wall Motors will be equipped with Hesai's various ADAS lidars, which are expected to be launched this year. In addition, the two parties also plan to cooperate based on the ultra-high-performance lidar technology under Hesai's new generation platform to jointly explore the forward-looking field of intelligent driving. (Financial Associated Press)
❸With
a total investment of 3 billion yuan, the second phase project of Shanghai Xinwei Semiconductor Co., Ltd. was launched in Lingang
It is reported that the construction content of the second phase of the Shanghai Xinwei Semiconductor Co., Ltd. is the electronic communications, radio and television-microelectronics product project. It is planned to build a new multi-story factory and warehouse with 3 floors, with a total investment of 3 billion yuan. As an advanced compound semiconductor wafer foundry company, Xinwei Semiconductor has first-class processes and unique solutions, focusing on providing diversified wafer foundry and supporting services for customers in the three major application fields of radio frequency, power and optoelectronics. The chips produced can be widely used in terminal application fields such as communications, new energy, consumer electronics, automobiles, industry, and biomedicine. (Future Semiconductor)
❹Polestar
received nearly US$1 billion in external financing
Recently, Polestar announced that the company has received US$950 million in external financing, which will help Polestar strengthen its future business layout, promote the implementation of business strategies, and achieve its 2025 development goals. Polestar has received US$950 million in external financing, which not only shows the market and investors' recognition of its brand and future development potential, but also reflects the firm support of Geely Holding as a strategic partner. (Mijing.com)
❶Renesas
Electronics launches visual AI and real-time control microprocessors without relying on cloud computing platforms
Recently, Renesas Electronics announced the launch of a new microprocessor (MPU) product RZ/V2H for high-performance robot applications. This new product can realize visual AI and real-time control functions. It is equipped with Renesas’ new generation proprietary AI accelerator DRP-AI3 (Dynamic Configurable Processor-AI3), which can bring an energy efficiency of 10 TOPS/W, an improvement of up to 10 TOPS/W compared to earlier models. 10 times. In addition, the pruning technology used in the DRP-AI3 accelerator significantly enhances AI computing efficiency, increasing AI inference performance to 80 TOPS, and can process visual AI applications directly on edge AI devices without relying on cloud computing platforms. (Science and Technology Innovation Board Daily)
❷The
Indian government approved a US$15.2 billion chip factory investment plan and is expected to start construction within 100 days
Ashwini Vishnu, Minister of Electronics and Information Technology of India, announced on February 29, local time, that the Indian government approved a US$15.2 billion investment plan for semiconductor manufacturing plants, including Tata Group’s construction of the country’s first large-scale chip manufacturing plant. plan. Specifically, Tata Group will cooperate with Power Semiconductor to build India's first chip manufacturing plant in Dholera, Gujarat, with an investment scale of 910 billion rupees; Tata Semiconductor Assembly and Testing, a subsidiary of Tata Group, will be established in Assam A chip packaging plant worth 270 billion rupees; CG Power, a subsidiary of Indian conglomerate Murugappa, will cooperate with Japan's Renesas Electronics and Thailand's Stars Microelectronics to build a 76 billion rupee chip packaging plant in Gujarat. Vishnu said that the construction of these factories will start in the next 100 days and will manufacture and package chips for India's defense, automotive and telecommunications industries after they are put into operation. (Financial Associated Press)
❸Xinlian
Integration signed a strategic agreement with Li Auto to deepen cooperation in automotive chips
According to Xinlian Integration’s official Weibo account on March 1, Xinlian Integration and Li Auto officially signed a strategic cooperation framework agreement. According to the agreement signed between the two parties, Xinlian Integration will launch a comprehensive strategic cooperation with Li Auto in the field of silicon carbide. Both parties will actively promote the productization process and jointly enhance the market competitiveness of both parties. At the same time, the two parties are also actively discussing the next step of in-depth cooperation in analog IC and other fields. (Mijing.com)
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