L1F2-U390100005001 datasheet, PDF

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L1F2-U390100005001: DescriptionHigh Power LEDs - Single Color UV/NUV 390nm-400nm; CategoryLED optoelectronic/LED photoelectric; File Size1MB，16 Pages; ManufacturerLumileds; Websitehttps://www.lumileds.com/; Environmental Compliance

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L1F2-U390100005001 Overview

High Power LEDs - Single Color UV/NUV 390nm-400nm

L1F2-U390100005001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Lumileds
Reach Compliance Code	compliant
Optoelectronic device types	SINGLE COLOR LED
Base Number Matches	1

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GENERAL ILLUMINATION

LUXEON FlipChip and

LUXEON FlipChip UV

Assembly and handling information

Introduction

This application brief addresses the recommended assembly and handling

procedures for LUXEON FlipChip and LUXEON FlipChip UV. Proper assembly and

handling, as outlined in this application brief, ensures high optical output and long

light output maintenance for LUXEON FlipChip and LUXEON FlipChip UV.

Scope

The assembly and handling guidelines in this application brief apply to the following

products with this part number designation as described below.

LXF2-YZZZ1000NNNN1

Where:

x–

y–

zzz –

1000 –

nnnn –

designates packaging type (0 for die on blue bin tape, 1 for die on tape and reel)

wavelength family (B for Royal Blue wavelength, U for Ultraviolet wavelength. See

respective datasheet.)

designates wavelength bin range (for Royal Blue — dominant wavelength bin, for

Ultraviolet — peak wavelength bin. See respective datasheet.)

designates die dimension (1000 for 1mm

)

esignates radiometric power bin range (0500 for 500mW min range. See respective

datasheet.)

In the remainder of this document the term LUXEON FlipChip refers to any product

in the LUXEON FlipChip product family.

Table of Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1 . LUXEON FlipChip Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 Optical Center and Property . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.3 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.4 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2 . LUXEON FlipChip Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.1 LUXEON FlipChip Footprint and Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 PCB Substrate Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.3 Surface Finishing on Copper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.5 Silk Screen or Ink Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.6 PCB Quality and Supplier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

3 . Assembly Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.1 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.2 Stencil Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.3 Die Attach (Pick and Place) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3.4 Pattern Recognition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.5 Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.6 Flux Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.7 Electrostatic Discharge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

4 . LED Package Component Assembly and Designing with Gold-Tin (AuSn) Solder . . . . . . . . . . . . .13

4.1 PCB Footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

4.2 Substrate Selection and Construction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.3 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.4 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.5 Stencil printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.6 Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

About Lumileds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

1. LUXEON FlipChip Details

1.1 Description

LUXEON FlipChip is designed to be compatible with and best suited for surface mount technology (SMT) processing

(Figure 1). The top finish of LUXEON FlipChip is sapphire (Figure 2). The solder pads on the bottom of LUXEON FlipChip are

finished with under-bump metallization (UBM), consisting of standard copper-nickel-gold (Cu-Ni-Au) layers, with gold being

the pad finishing. This pad configuration is not suitable to be used with silver attach epoxy method. The anode pad has a

small notch in the center of the pad (Figure 2).

Section 4 discusses a special case where LUXEON FlipChip is intended to be assembled into a LED package component via

gold-tin solder chip attach. This LED package may contain phosphor material and/or polymeric lens and is intended to be

later assembled onto another PCB substrate, thus exposing LUXEON FlipChip to two times reflow.

When operating LUXEON FlipChip UV, proper safety precaution must be followed to protect eyes and skin from UV exposure.

1.2 Optical Center and Property

The theoretical optical center of LUXEON FlipChip coincides with the mechanical center of the chip. The sapphire substrate

as shown in Figure 2 is visibly transparent and allows light to escape from the active layer (p-n junction) which is located at

the base of the chip on which the anode and cathode pads are formed. Due to its construction, about 13% of the light is

back scattered (reflected and refracted) behind the chip (Figure 3). In order to maximize light output extraction, the chip

must be mounted on a reflective surface. The reflectance spectrum of the surrounding surface will affect the chromaticity

color point of LUXEON FlipChip.

When designing optical lens over LUXEON FlipChip UV, the lens material selected should be able to withstand prolong

UV exposure. For example, an untreated standard grade polycarbonate (PC) lens will absorb UV and turns yellowish over

prolong UV exposure and will reduce the light output performance of the whole LED system. Lumileds recommends

customer to discuss the impact of UV light on lens material with lens suppliers.

Figure 1. Generic SMT process flow.

Figure 2. Relevant mechanical features (in mm) for LUXEON FlipChip and photos of

LUXEON FlipChip showing the anode and cathode markings.

L1F2-U390100005001 Related Products

	L1F2-U390100005001	L1F2-U390100004001	L1F2-U380100002001	L1F2-U390100006001
Description	High Power LEDs - Single Color UV/NUV 390nm-400nm			Infrared Emitters - High Power Infrared 940nm OSLON Black
Maker	Lumileds	Lumileds	Lumileds	Lumileds
Reach Compliance Code	compliant	compliant	compliant	compliant
Optoelectronic device types	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED
Is it Rohs certified?	conform to	-	conform to	conform to

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