L1F2-U390100006001 datasheet, PDF

Datasheet> All Categories > LED optoelectronic/LED> photoelectric> L1F2-U390100006001

L1F2-U390100006001: DescriptionInfrared Emitters - High Power Infrared 940nm OSLON Black; CategoryLED optoelectronic/LED photoelectric; File Size1MB，16 Pages; ManufacturerLumileds; Websitehttps://www.lumileds.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

L1F2-U390100006001 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	L1F2-U390100006001	-	-	View	Buy Now

L1F2-U390100006001 Overview

Infrared Emitters - High Power Infrared 940nm OSLON Black

L1F2-U390100006001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Lumileds
Reach Compliance Code	compliant
Optoelectronic device types	SINGLE COLOR LED

Preview

Download Datasheet

View All

GENERAL ILLUMINATION

LUXEON FlipChip and

LUXEON FlipChip UV

Assembly and handling information

Introduction

This application brief addresses the recommended assembly and handling

procedures for LUXEON FlipChip and LUXEON FlipChip UV. Proper assembly and

handling, as outlined in this application brief, ensures high optical output and long

light output maintenance for LUXEON FlipChip and LUXEON FlipChip UV.

Scope

The assembly and handling guidelines in this application brief apply to the following

products with this part number designation as described below.

LXF2-YZZZ1000NNNN1

Where:

x–

y–

zzz –

1000 –

nnnn –

designates packaging type (0 for die on blue bin tape, 1 for die on tape and reel)

wavelength family (B for Royal Blue wavelength, U for Ultraviolet wavelength. See

respective datasheet.)

designates wavelength bin range (for Royal Blue — dominant wavelength bin, for

Ultraviolet — peak wavelength bin. See respective datasheet.)

designates die dimension (1000 for 1mm

)

esignates radiometric power bin range (0500 for 500mW min range. See respective

datasheet.)

In the remainder of this document the term LUXEON FlipChip refers to any product

in the LUXEON FlipChip product family.

Table of Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1 . LUXEON FlipChip Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 Optical Center and Property . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.3 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.4 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2 . LUXEON FlipChip Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.1 LUXEON FlipChip Footprint and Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 PCB Substrate Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.3 Surface Finishing on Copper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.5 Silk Screen or Ink Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.6 PCB Quality and Supplier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

3 . Assembly Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.1 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.2 Stencil Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3.3 Die Attach (Pick and Place) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3.4 Pattern Recognition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.5 Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.6 Flux Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.7 Electrostatic Discharge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

4 . LED Package Component Assembly and Designing with Gold-Tin (AuSn) Solder . . . . . . . . . . . . .13

4.1 PCB Footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

4.2 Substrate Selection and Construction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.3 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.4 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.5 Stencil printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.6 Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

About Lumileds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

1. LUXEON FlipChip Details

1.1 Description

LUXEON FlipChip is designed to be compatible with and best suited for surface mount technology (SMT) processing

(Figure 1). The top finish of LUXEON FlipChip is sapphire (Figure 2). The solder pads on the bottom of LUXEON FlipChip are

finished with under-bump metallization (UBM), consisting of standard copper-nickel-gold (Cu-Ni-Au) layers, with gold being

the pad finishing. This pad configuration is not suitable to be used with silver attach epoxy method. The anode pad has a

small notch in the center of the pad (Figure 2).

Section 4 discusses a special case where LUXEON FlipChip is intended to be assembled into a LED package component via

gold-tin solder chip attach. This LED package may contain phosphor material and/or polymeric lens and is intended to be

later assembled onto another PCB substrate, thus exposing LUXEON FlipChip to two times reflow.

When operating LUXEON FlipChip UV, proper safety precaution must be followed to protect eyes and skin from UV exposure.

1.2 Optical Center and Property

The theoretical optical center of LUXEON FlipChip coincides with the mechanical center of the chip. The sapphire substrate

as shown in Figure 2 is visibly transparent and allows light to escape from the active layer (p-n junction) which is located at

the base of the chip on which the anode and cathode pads are formed. Due to its construction, about 13% of the light is

back scattered (reflected and refracted) behind the chip (Figure 3). In order to maximize light output extraction, the chip

must be mounted on a reflective surface. The reflectance spectrum of the surrounding surface will affect the chromaticity

color point of LUXEON FlipChip.

When designing optical lens over LUXEON FlipChip UV, the lens material selected should be able to withstand prolong

UV exposure. For example, an untreated standard grade polycarbonate (PC) lens will absorb UV and turns yellowish over

prolong UV exposure and will reduce the light output performance of the whole LED system. Lumileds recommends

customer to discuss the impact of UV light on lens material with lens suppliers.

Figure 1. Generic SMT process flow.

Figure 2. Relevant mechanical features (in mm) for LUXEON FlipChip and photos of

LUXEON FlipChip showing the anode and cathode markings.

L1F2-U390100006001 Related Products

	L1F2-U390100006001	L1F2-U390100004001	L1F2-U380100002001	L1F2-U390100005001
Description	Infrared Emitters - High Power Infrared 940nm OSLON Black			High Power LEDs - Single Color UV/NUV 390nm-400nm
Maker	Lumileds	Lumileds	Lumileds	Lumileds
Reach Compliance Code	compliant	compliant	compliant	compliant
Optoelectronic device types	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED	SINGLE COLOR LED
Is it Rohs certified?	conform to	-	conform to	conform to

Recommended Resources

Battery fast charging control integrated circuit design

Infrared remote control light switch circuit (2)

High frequency amplitude modulation signal generator circuit

HY-100 audio application circuit

555 multifunctional refrigerator controller circuit

TP-8CB type 10W FM speaker circuit diagram

I would like to ask about the AMS1117 and LM2596S chips: I have to work on a logistics robot topic for a work training competition recently, so I am learning how to draw integrated circuit boards. The chip I use is STM32F407VET6. Now I am very confused abou...; ILAI PCB Design

Why are all villains so stupid?: Those villains in novels rack their brains to harm the protagonist. I think they are really weak in intelligence. Don’t they know what the protagonist’s halo is? What I am saying is not that you shoul...; led2015 Talking

Pipeline Leakage Monitor Based on Sound Waves: Pipeline Leakage Monitor Based on Sound WavesAuthor: Jason YooIntroductionLeakage in urban water supply pipelines causes great losses to the country every year. This product is a water pipe leakage mo...; JasonYoo DigiKey Technology Zone

See good people and emulate them, Zhu Ge is full of positive energy^_^: I went to Anhui in mid-April for a business trip. The last time I came to Anhui was in 2014. After 6 years, Anhui has changed a lot. The sky is blue, the water is clear, the temperature is suitable, a...; longmotto Talking

[Mil MYS-8MMX] Mil MYS-8MMQ6-8E2D-180-C Unpacking Report 2 - Power on: The board has a standard USB port and a Type-C port , neither of which can be used for power input. After connecting to the power supply, the board can be directly connected to the HDMI display to lig...; tobot Embedded System

MSP430 MCU timer TA interrupt program: For a detailed explanation of this program, you can download the e-book by clicking on the picture above.The original book contains 4 programs in totalProgram 1 #include msp430x41x.hvoid main(void){WD...; 灞波儿奔 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components