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T81L0003B

Description
8-bit mcu
File Size97KB,16 Pages
ManufacturerTM Technology, Inc.
Websitehttp://www.tmtech.com.tw/
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T81L0003B Overview

8-bit mcu

T81L0003B Related Products

T81L0003B T81L0003B-AK T81L0003B-BD T81L0003B-BK T81L0003B-AD
Description 8-bit mcu 8-bit mcu 8-bit mcu 8-bit mcu 8-bit mcu
Maker - TM Technology, Inc. TM Technology, Inc. TM Technology, Inc. TM Technology, Inc.
Parts packaging code - DIP SOIC DIP SOIC
package instruction - DIP, DIP18,.3 SOP, SOP18,.4 DIP, DIP18,.3 SOP, SOP18,.4
Contacts - 18 18 18 18
Reach Compliance Code - unknown unknown unknown unknown
bit size - 8 8 8 8
CPU series - 8051 8051 8051 8051
JESD-30 code - R-PDIP-T18 R-PDSO-G18 R-PDIP-T18 R-PDSO-G18
Number of terminals - 18 18 18 18
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP SOP DIP SOP
Encapsulate equivalent code - DIP18,.3 SOP18,.4 DIP18,.3 SOP18,.4
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
power supply - 3.3 V 3.3 V 3.3 V 3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) - 256 256 256 256
rom(word) - 8192 8192 8192 8192
ROM programmability - UVPROM UVPROM UVPROM UVPROM
speed - 24 MHz 24 MHz 24 MHz 24 MHz
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - NO YES NO YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch - 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location - DUAL DUAL DUAL DUAL
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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