8-bit mcu
T81L0003B | T81L0003B-AK | T81L0003B-BD | T81L0003B-BK | T81L0003B-AD | |
---|---|---|---|---|---|
Description | 8-bit mcu | 8-bit mcu | 8-bit mcu | 8-bit mcu | 8-bit mcu |
Maker | - | TM Technology, Inc. | TM Technology, Inc. | TM Technology, Inc. | TM Technology, Inc. |
Parts packaging code | - | DIP | SOIC | DIP | SOIC |
package instruction | - | DIP, DIP18,.3 | SOP, SOP18,.4 | DIP, DIP18,.3 | SOP, SOP18,.4 |
Contacts | - | 18 | 18 | 18 | 18 |
Reach Compliance Code | - | unknown | unknown | unknown | unknown |
bit size | - | 8 | 8 | 8 | 8 |
CPU series | - | 8051 | 8051 | 8051 | 8051 |
JESD-30 code | - | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 |
Number of terminals | - | 18 | 18 | 18 | 18 |
Maximum operating temperature | - | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | DIP | SOP | DIP | SOP |
Encapsulate equivalent code | - | DIP18,.3 | SOP18,.4 | DIP18,.3 | SOP18,.4 |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
power supply | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | - | 256 | 256 | 256 | 256 |
rom(word) | - | 8192 | 8192 | 8192 | 8192 |
ROM programmability | - | UVPROM | UVPROM | UVPROM | UVPROM |
speed | - | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
Nominal supply voltage | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | - | NO | YES | NO | YES |
technology | - | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | - | DUAL | DUAL | DUAL | DUAL |