T81L0003B-AD Related Products
|
T81L0003B-AD |
T81L0003B-AK |
T81L0003B-BD |
T81L0003B |
T81L0003B-BK |
Description |
8-bit mcu |
8-bit mcu |
8-bit mcu |
8-bit mcu |
8-bit mcu |
Maker |
TM Technology, Inc. |
TM Technology, Inc. |
TM Technology, Inc. |
- |
TM Technology, Inc. |
Parts packaging code |
SOIC |
DIP |
SOIC |
- |
DIP |
package instruction |
SOP, SOP18,.4 |
DIP, DIP18,.3 |
SOP, SOP18,.4 |
- |
DIP, DIP18,.3 |
Contacts |
18 |
18 |
18 |
- |
18 |
Reach Compliance Code |
unknown |
unknown |
unknown |
- |
unknown |
bit size |
8 |
8 |
8 |
- |
8 |
CPU series |
8051 |
8051 |
8051 |
- |
8051 |
JESD-30 code |
R-PDSO-G18 |
R-PDIP-T18 |
R-PDSO-G18 |
- |
R-PDIP-T18 |
Number of terminals |
18 |
18 |
18 |
- |
18 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
- |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
SOP |
DIP |
SOP |
- |
DIP |
Encapsulate equivalent code |
SOP18,.4 |
DIP18,.3 |
SOP18,.4 |
- |
DIP18,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
- |
IN-LINE |
power supply |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
RAM (bytes) |
256 |
256 |
256 |
- |
256 |
rom(word) |
8192 |
8192 |
8192 |
- |
8192 |
ROM programmability |
UVPROM |
UVPROM |
UVPROM |
- |
UVPROM |
speed |
24 MHz |
24 MHz |
24 MHz |
- |
24 MHz |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
surface mount |
YES |
NO |
YES |
- |
NO |
technology |
CMOS |
CMOS |
CMOS |
- |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
Terminal form |
GULL WING |
THROUGH-HOLE |
GULL WING |
- |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
- |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
- |
DUAL |