T81L0003B-AK datasheet, PDF - EEWORLD Datasheet

T81L0003B-AK: Description8-bit mcu; CategoryThe embedded processor and controller Microcontrollers and processors; File Size97KB，16 Pages; ManufacturerTM Technology, Inc.; Websitehttp://www.tmtech.com.tw/

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T81L0003B-AK Overview

8-bit mcu

Parameter Name	Attribute value
Maker	TM Technology, Inc.
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-PDIP-T18
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	8192
ROM programmability	UVPROM
speed	24 MHz
Nominal supply voltage	3.3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	T81L0003B-AK	T81L0003B-BD	T81L0003B	T81L0003B-BK	T81L0003B-AD
Description	8-bit mcu	8-bit mcu	8-bit mcu	8-bit mcu	8-bit mcu
Maker	TM Technology, Inc.	TM Technology, Inc.	-	TM Technology, Inc.	TM Technology, Inc.
Parts packaging code	DIP	SOIC	-	DIP	SOIC
package instruction	DIP, DIP18,.3	SOP, SOP18,.4	-	DIP, DIP18,.3	SOP, SOP18,.4
Contacts	18	18	-	18	18
Reach Compliance Code	unknown	unknown	-	unknown	unknown
bit size	8	8	-	8	8
CPU series	8051	8051	-	8051	8051
JESD-30 code	R-PDIP-T18	R-PDSO-G18	-	R-PDIP-T18	R-PDSO-G18
Number of terminals	18	18	-	18	18
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	-	DIP	SOP
Encapsulate equivalent code	DIP18,.3	SOP18,.4	-	DIP18,.3	SOP18,.4
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	-	IN-LINE	SMALL OUTLINE
power supply	3.3 V	3.3 V	-	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
RAM (bytes)	256	256	-	256	256
rom(word)	8192	8192	-	8192	8192
ROM programmability	UVPROM	UVPROM	-	UVPROM	UVPROM
speed	24 MHz	24 MHz	-	24 MHz	24 MHz
Nominal supply voltage	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	NO	YES	-	NO	YES
technology	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	-	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL

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