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IDT72V3676L10PFG8

Description
FIFO, 8KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128
Categorystorage    storage   
File Size386KB,39 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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IDT72V3676L10PFG8 Overview

FIFO, 8KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128

IDT72V3676L10PFG8 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionTQFP-128
Contacts128
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time6.5 ns
Other featuresMAIL BOX BYPASS REGISTER
period time10 ns
JESD-30 codeR-PQFP-G128
JESD-609 codee3
length20 mm
memory density294912 bit
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count8192 words
character code8000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1
3.3 VOLT CMOS TRIPLE BUS SyncFIFO
TM
WITH BUS-MATCHING
2,048 x 36 x 2
4,096 x 36 x 2
8,192 x 36 x 2
IDT72V3656
IDT72V3666
IDT72V3676
FEATURES
Memory storage capacity:
IDT72V3656 – 2,048 x 36 x 2
IDT72V3666 – 4,096 x 36 x 2
IDT72V3676 – 8,192 x 36 x 2
Clock frequencies up to 100 MHz (6.5ns access time)
Two independent FIFOs buffer data between one bidirectional
36-bit port and two unidirectional 18-bit ports (Port C receives
and Port B transmits)
18-bit (word) and 9-bit (byte) bus sizing of 18 bits (word) on
Ports B and C
Select IDT Standard timing (using
EFA
,
EFB
,
FFA
, and
FFC
flag
functions) or First Word Fall Through Timing (using ORA, ORB,
IRA, and IRC flag functions)
Programmable Almost-Empty and Almost-Full flags; each has
five default offsets (8, 16, 64, 256 and 1,024)
Serial or parallel programming of partial flags
Big- or Little-Endian format for word and byte bus sizes
Loopback mode on Port A
Retransmit Capability
Master Reset clears data and configures FIFO, Partial Reset
clears data but retains configuration settings
Mailbox bypass registers for each FIFO
Free-running CLKA, CLKB and CLKC may be asynchronous or
coincident (simultaneous reading and writing of data on a single
clock edge is permitted)
Auto power down minimizes power dissipation
Available in a space-saving 128-pin Thin Quad Flatpack (TQFP)
Pin and functionally compatible versions of the 5V parts,
IDT723656/723666/723676
Pin compatible to the lower density parts, IDT72V3626/3636/3646
Industrial temperature range (–40°C to +85°C) is available
°
°
FUNCTIONAL BLOCK DIAGRAM
MBF1
CLKA
CSA
W/RA
ENA
MBA
LOOP
MRS1
PRS1
Mail 1
Register
Output Bus-
Matching
Output
Register
Input
Register
Port-A
Control
Logic
18
B
0
-B
17
36
RAM ARRAY
2,048 x 36
4,096 x 36
8,192 x 36
36
FIFO1,
Mail1
Reset
Logic
36
Port-B
Control
Logic
Write
Pointer
Read
Pointer
CLKB
RENB
CSB
MBB
SIZEB
FFA/IRA
AFA
FS2
FS0/SD
FS1/SEN
A
0
-A
35
EFA/ORA
AEA
FIFO1
Status Flag
Logic
Common
Port
Control
Logic
(B and C)
EFB/ORB
AEB
Programmable Flag
Offset Registers
13
FIFO2
Timing
Mode
BE
Status Flag
Logic
Read
Pointer
Write
Pointer
FIFO2,
Mail2
Reset
Logic
Input Bus-
Matching
Input
Register
18
FWFT
FFC/IRC
AFC
MRS2
PRS2
36
RT1
RTM
RT2
Output
Register
FIFO1 and
FIFO2
Retransmit
Logic
36
RAM ARRAY
2,048 x 36
4,096 x 36
8,192 x 36
Mail 2
Register
36
C
0
-C
17
CLKC
WENC
MBC
SIZEC
4665 drw01
Port-C
Control
Logic
MBF2
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SyncFIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGE
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-4665/3

IDT72V3676L10PFG8 Related Products

IDT72V3676L10PFG8 IDT72V3666L15PFG8 IDT72V3666L10PFG8
Description FIFO, 8KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 4KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 4KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP QFP QFP
package instruction TQFP-128 LFQFP, LFQFP,
Contacts 128 128 128
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 6.5 ns 10 ns 6.5 ns
Other features MAIL BOX BYPASS REGISTER MAIL BOX BYPASS REGISTER MAIL BOX BYPASS REGISTER
period time 10 ns 15 ns 10 ns
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609 code e3 e3 e3
length 20 mm 20 mm 20 mm
memory density 294912 bit 147456 bit 147456 bit
memory width 36 36 36
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 128 128 128
word count 8192 words 4096 words 4096 words
character code 8000 4000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 8KX36 4KX36 4KX36
Exportable YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.45 V 3.6 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V 3 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30
width 14 mm 14 mm 14 mm
Base Number Matches 1 1 1
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