Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54
Parameter Name | Attribute value |
Parts packaging code | BGA |
package instruction | TBGA, |
Contacts | 54 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | BLOCK ORIENTED PROTOCOL |
Other features | SELF CONTAINED REFRESH |
JESD-30 code | R-PBGA-B54 |
memory density | 268435456 bit |
Memory IC Type | RAMBUS DRAM |
memory width | 16 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 54 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
organize | 16MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 2.63 V |
Minimum supply voltage (Vsup) | 2.37 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Base Number Matches | 1 |
256MD-50-711 | 256MD-40-800 | 256MD-45-711 | 256MD-45-800 | 256MD-53-600 | 288MD-40-800 | 288MD-50-711 | 288MD-45-711 | 288MD-45-800 | 288MD-53-600 | |
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Description | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Contacts | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
JESD-30 code | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 |
memory density | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit |
Memory IC Type | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
memory width | 16 | 16 | 16 | 16 | 16 | 18 | 18 | 18 | 18 | 18 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
word count | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
character code | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
organize | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
Minimum supply voltage (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |