4310T-101-2741BCL datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> 4310T-101-2741BCL

4310T-101-2741BCL: DescriptionArray/Network Resistor, Bussed, Thin Film, 1.25W, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT; CategoryPassive components The resistor; File Size198KB，2 Pages; ManufacturerBourns; Websitehttp://www.bourns.com; Environmental Compliance

Download Datasheet Parametric View All

4310T-101-2741BCL Overview

Array/Network Resistor, Bussed, Thin Film, 1.25W, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT

4310T-101-2741BCL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1998640222
package instruction	SIP, ROHS COMPLIANT
Reach Compliance Code	not_compliant
ECCN code	EAR99
Component power consumption	0.1 W
The first element resistor	2740 Ω
JESD-609 code	e3
Manufacturer's serial number	4300T
Installation features	THROUGH HOLE MOUNT
Network Type	BUSSED
Number of components	9
Number of functions	1
Number of terminals	10
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Rated power dissipation(P)	1.25 W
Rated temperature	70 °C
Resistor type	ARRAY/NETWORK RESISTOR
surface mount	NO
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Temperature coefficient tracking	5 ppm/°C
Terminal surface	Tin (Sn)
Terminal shape	FLAT
Tolerance	0.1%
Operating Voltage	50 V

Preview

Download Datasheet

View All

VE S CO

AV R M

AI SIO PL

LA N IA

BL S NT

Features

■

RoHS compliant* (see How to Order

“Termination” option)

Low profile provides compatibility with

DIPs

Also available in medium profile (4300S -

.250 ”) and high profile (4300K - .350 ”)

Marking on contrasting background

■

Custom circuits available per factory

4300T, S, K Series - Thin Film Molded SIP

Product Characteristics

Resistance Range

Bussed ...................49.9 to 100K ohms

Isolated ......................20 to 200K ohms

Series.........................20 to 100K ohms

Resistance Tolerance

.........................±0.1 %, ±0.5 %, ±1 %

Temperature Coefficient

..................±100 ppm/°C, ±50 ppm/°C,

±25 ppm/°C

Temperature Range ....-55 °C to +125 °C

Insulation Resistance

..................10,000 megohms minimum

TCR Tracking .........................±5 ppm/°C

Maximum Operating Voltage............50 V

Environmental Characteristics

Thermal Shock and

Power Conditioning ...................... 0.1 %

Short Time Overload ..................... 0.1 %

Terminal Strength ........................ 0.25 %

Resistance to Soldering Heat ....... 0.1 %

Moisture Resistance ..................... 0.1 %

Life .............................................. 0.50 %

Physical Characteristics

Body Material Flammability

...........................Conforms to UL94V-0

Lead Frame Material

..........................Copper, solder coated

Body Material ..................Novolac epoxy

How To Order

Package Power Temp. Derating Curve

(Low Profile, 4300T)

(

)

1.75

1.50

4311T

WATTS

1.25

1.00

.75

.50

.25

4310T

4309T

4308T

4306T

Product Dimensions

27.53

MAX.

(1.084)

22.45

MAX.

(.884)

14.83 MAX.

(.584)

24.99

MAX.

(.984)

19.92

MAX.

(.784)

PIN #1 REF.

4.95

(.195)

MAX.

.381 + .127/ - .000

(.015 + .005/ - 000)

2.54

.07

(.100

.003*)

TYP.

NON-ACCUM.

3.43 + .38/ - .25

(.135 + .015/ - .010)

1.02

.12

(.040

.005)

.483

.050

TYP.

(.020

.002)

2.16

.10

(.085

.004)

150

125

AMBIENT TEMPERATURE (

C )

Package Power Ratings at 70°C

4304 .......... ............ 0.60...... 0.80 watts

4306 ...... 0.75.......... 0.90...... 1.20 watts

4308 ...... 1.00.......... 1.20...... 1.60 watts

4309 ...... 1.13 ................................watts

4310 ...... 1.25.......... 1.50...... 2.00 watts

4311 ...... 1.38 ................................watts

1.02

.05

(.0425

.002)

.254

.050

(.010

.002)

Governing dimensions are in metric. Dimensions in parentheses

are inches and are approximate.

*Terminal centerline to centerline measurements made at point of

emergence of the lead from the body.

43 11 T - 101 - 2222 F A B __

Model

(43 = Molded SIP)

Number of Pins

Physical Config.

•T = Low Profile Thin Film

•S = Med. Profile Thin Film

•K = High Profile Thin Film

Electrical Configuration

•101 = Bussed

•102 = Isolated

•106 = Series

Resistance Code

•First 3 digits are significant

•Fourth digit represents the

number of zeros to follow.

Absolute Tolerance Code

•B = ±0.1%

•F = ±1%

•D = ±0.5%

Temperature Coefficient Code

•A = ±100ppm/°C •C = ±25ppm/°C

•B = ±50ppm/°C

Ratio Tolerance (Optional)

•A = ±0.05% to R1 •D = ±0.5% to R1

•B = ±0.1% to R1

Terminations

• L = Tin-plated (RoHS compliant version)

• Blank = Tin/Lead-plated

Consult factory for other available options.

Typical Part Marking

Represents total content. Layout may vary.

PART

NUMBER

4311T-101-

1003BB

YYWW

CIRCUIT

RESISTANCE

CODE

DATE CODE

PIN ONE

INDICATOR

MANUFACTURER'S

TRADEMARK

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Recommended Resources

PCB board interconnection method

An FM transmitter overvoltage protection circuit diagram

Star connection motor phase failure protection circuit

Use low operating voltage relays for mains circuits c

Handmade MP3 player circuit and information

Clapp signal generator circuit

General Grounding Guidelines for Most Mixed-Signal Devices: Grounding is an issue that cannot be ignored for all analog designs, and proper implementation of grounding is equally important in PCB-based circuits. Digital and analog design engineers tend to look...; Aguilera Analogue and Mixed Signal

What are the thermal challenges of a Wi-Fi front end?: In modern people's lives, Wi-Fi has become a part of daily life, and the public's demand for Wi-Fi is increasing. In order to build a better Wi-Fi network and let everyone enjoy the wireless network, ...; alan000345 RF/Wirelessly

FAQ Bluetooth transmission questions and answers: Bluetooth transmission QA ( provided by TI embedded field application engineer Michael Qian ) 1. What are the advantages of Bluetooth 5.0 in terms of power consumption compared to Bluetooth 4.0? Curre...; qwqwqw2088 Wireless Connectivity

If the database is deleted, it must be run away! What if AI deletes the database?: [b][size=3][font=微软雅黑]Let me share an article with you first: [/font][font=微软雅黑][url=https://mp.weixin.qq.com/s/CAjDQf_f6UWiQBLTRDN7Ww]On-site visit to Henan AI Village: New "Foxconn Workers" Labeling...; eric_wang Talking

Low power MCU design concept: [size=3]Low-power and high-performance CPU cores[/size] [size=3] [/size] [size=3] Early low-power MCUs were limited by cost and process technology, and most of them chose 8-bit CPU cores. However, wit...; fish001 Microcontroller MCU

DSK6713 big endian mode: Help: When I was using the DSK development board to learn TMS320C6713, I tried to use big-endian mode. When I downloaded the code after compiling, the error "DATA Vrification failed" appeared. 1. The ...; keil050312223 DSP and ARM Processors

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components