W78L54 datasheet, PDF - EEWORLD Datasheet

W78L54: Description8-bit microcontroller; File Size20KB，2 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W78L54 Overview

8-bit microcontroller

W78L54 Related Products

	W78L54	W78L54P-24	W78L54-24	W78L54F-24
Description	8-bit microcontroller	8-bit microcontroller	8-bit microcontroller	8-bit microcontroller
Is it Rohs certified?	-	incompatible	incompatible	incompatible
Maker	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	-	LCC	DIP	QFP
package instruction	-	PLASTIC, LCC-44	DIP-40	QFP-44
Contacts	-	44	40	44
Reach Compliance Code	-	_compli	_compli	_compli
Has ADC	-	NO	NO	NO
Address bus width	-	16	16	16
bit size	-	8	8	8
CPU series	-	8051	8051	8051
maximum clock frequency	-	24 MHz	24 MHz	24 MHz
DAC channel	-	NO	NO	NO
DMA channel	-	NO	NO	NO
External data bus width	-	8	8	8
JESD-30 code	-	S-PQCC-J44	R-PDIP-T40	S-PQFP-G44
JESD-609 code	-	e0	e0	e0
length	-	16.59 mm	52.2 mm	10 mm
Number of I/O lines	-	36	32	36
Number of terminals	-	44	40	44
Maximum operating temperature	-	70 °C	70 °C	70 °C
PWM channel	-	NO	NO	NO
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	QCCJ	DIP	QFP
Encapsulate equivalent code	-	LDCC44,.7SQ	DIP40,.6	QFP44,.5SQ,32
Package shape	-	SQUARE	RECTANGULAR	SQUARE
Package form	-	CHIP CARRIER	IN-LINE	FLATPACK
Peak Reflow Temperature (Celsius)	-	225	NOT SPECIFIED	NOT SPECIFIED
power supply	-	2/5 V	2/5 V	2/5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	-	256	256	256
rom(word)	-	16384	16384	16384
ROM programmability	-	MROM	MROM	MROM
Maximum seat height	-	4.699 mm	5.334 mm	2.7 mm
speed	-	24 MHz	24 MHz	24 MHz
Maximum slew rate	-	20 mA	20 mA	20 mA
Maximum supply voltage	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage	-	1.8 V	1.8 V	1.8 V
Nominal supply voltage	-	2 V	2 V	2 V
surface mount	-	YES	NO	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	J BEND	THROUGH-HOLE	GULL WING
Terminal pitch	-	1.27 mm	2.54 mm	0.8 mm
Terminal location	-	QUAD	DUAL	QUAD
Maximum time at peak reflow temperature	-	30	NOT SPECIFIED	NOT SPECIFIED
width	-	16.59 mm	15.24 mm	10 mm
uPs/uCs/peripheral integrated circuit type	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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