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W78L54-24

Description
8-bit microcontroller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size20KB,2 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W78L54-24 Overview

8-bit microcontroller

W78L54-24 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeDIP
package instructionDIP-40
Contacts40
Reach Compliance Code_compli
Has ADCNO
Address bus width16
bit size8
CPU series8051
maximum clock frequency24 MHz
DAC channelNO
DMA channelNO
External data bus width8
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length52.2 mm
Number of I/O lines32
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)16384
ROM programmabilityMROM
Maximum seat height5.334 mm
speed24 MHz
Maximum slew rate20 mA
Maximum supply voltage5.5 V
Minimum supply voltage1.8 V
Nominal supply voltage2 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

W78L54-24 Related Products

W78L54-24 W78L54P-24 W78L54 W78L54F-24
Description 8-bit microcontroller 8-bit microcontroller 8-bit microcontroller 8-bit microcontroller
Is it Rohs certified? incompatible incompatible - incompatible
Maker Winbond Electronics Corporation Winbond Electronics Corporation - Winbond Electronics Corporation
Parts packaging code DIP LCC - QFP
package instruction DIP-40 PLASTIC, LCC-44 - QFP-44
Contacts 40 44 - 44
Reach Compliance Code _compli _compli - _compli
Has ADC NO NO - NO
Address bus width 16 16 - 16
bit size 8 8 - 8
CPU series 8051 8051 - 8051
maximum clock frequency 24 MHz 24 MHz - 24 MHz
DAC channel NO NO - NO
DMA channel NO NO - NO
External data bus width 8 8 - 8
JESD-30 code R-PDIP-T40 S-PQCC-J44 - S-PQFP-G44
JESD-609 code e0 e0 - e0
length 52.2 mm 16.59 mm - 10 mm
Number of I/O lines 32 36 - 36
Number of terminals 40 44 - 44
Maximum operating temperature 70 °C 70 °C - 70 °C
PWM channel NO NO - NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code DIP QCCJ - QFP
Encapsulate equivalent code DIP40,.6 LDCC44,.7SQ - QFP44,.5SQ,32
Package shape RECTANGULAR SQUARE - SQUARE
Package form IN-LINE CHIP CARRIER - FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED 225 - NOT SPECIFIED
power supply 2/5 V 2/5 V - 2/5 V
Certification status Not Qualified Not Qualified - Not Qualified
RAM (bytes) 256 256 - 256
rom(word) 16384 16384 - 16384
ROM programmability MROM MROM - MROM
Maximum seat height 5.334 mm 4.699 mm - 2.7 mm
speed 24 MHz 24 MHz - 24 MHz
Maximum slew rate 20 mA 20 mA - 20 mA
Maximum supply voltage 5.5 V 5.5 V - 5.5 V
Minimum supply voltage 1.8 V 1.8 V - 1.8 V
Nominal supply voltage 2 V 2 V - 2 V
surface mount NO YES - YES
technology CMOS CMOS - CMOS
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND - GULL WING
Terminal pitch 2.54 mm 1.27 mm - 0.8 mm
Terminal location DUAL QUAD - QUAD
Maximum time at peak reflow temperature NOT SPECIFIED 30 - NOT SPECIFIED
width 15.24 mm 16.59 mm - 10 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER

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