|
W78L54-24 |
W78L54P-24 |
W78L54 |
W78L54F-24 |
Description |
8-bit microcontroller |
8-bit microcontroller |
8-bit microcontroller |
8-bit microcontroller |
Is it Rohs certified? |
incompatible |
incompatible |
- |
incompatible |
Maker |
Winbond Electronics Corporation |
Winbond Electronics Corporation |
- |
Winbond Electronics Corporation |
Parts packaging code |
DIP |
LCC |
- |
QFP |
package instruction |
DIP-40 |
PLASTIC, LCC-44 |
- |
QFP-44 |
Contacts |
40 |
44 |
- |
44 |
Reach Compliance Code |
_compli |
_compli |
- |
_compli |
Has ADC |
NO |
NO |
- |
NO |
Address bus width |
16 |
16 |
- |
16 |
bit size |
8 |
8 |
- |
8 |
CPU series |
8051 |
8051 |
- |
8051 |
maximum clock frequency |
24 MHz |
24 MHz |
- |
24 MHz |
DAC channel |
NO |
NO |
- |
NO |
DMA channel |
NO |
NO |
- |
NO |
External data bus width |
8 |
8 |
- |
8 |
JESD-30 code |
R-PDIP-T40 |
S-PQCC-J44 |
- |
S-PQFP-G44 |
JESD-609 code |
e0 |
e0 |
- |
e0 |
length |
52.2 mm |
16.59 mm |
- |
10 mm |
Number of I/O lines |
32 |
36 |
- |
36 |
Number of terminals |
40 |
44 |
- |
44 |
Maximum operating temperature |
70 °C |
70 °C |
- |
70 °C |
PWM channel |
NO |
NO |
- |
NO |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
DIP |
QCCJ |
- |
QFP |
Encapsulate equivalent code |
DIP40,.6 |
LDCC44,.7SQ |
- |
QFP44,.5SQ,32 |
Package shape |
RECTANGULAR |
SQUARE |
- |
SQUARE |
Package form |
IN-LINE |
CHIP CARRIER |
- |
FLATPACK |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
225 |
- |
NOT SPECIFIED |
power supply |
2/5 V |
2/5 V |
- |
2/5 V |
Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
RAM (bytes) |
256 |
256 |
- |
256 |
rom(word) |
16384 |
16384 |
- |
16384 |
ROM programmability |
MROM |
MROM |
- |
MROM |
Maximum seat height |
5.334 mm |
4.699 mm |
- |
2.7 mm |
speed |
24 MHz |
24 MHz |
- |
24 MHz |
Maximum slew rate |
20 mA |
20 mA |
- |
20 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
- |
5.5 V |
Minimum supply voltage |
1.8 V |
1.8 V |
- |
1.8 V |
Nominal supply voltage |
2 V |
2 V |
- |
2 V |
surface mount |
NO |
YES |
- |
YES |
technology |
CMOS |
CMOS |
- |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
- |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
J BEND |
- |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
- |
0.8 mm |
Terminal location |
DUAL |
QUAD |
- |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
30 |
- |
NOT SPECIFIED |
width |
15.24 mm |
16.59 mm |
- |
10 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER |
MICROCONTROLLER |
- |
MICROCONTROLLER |