W78L54P-24 datasheet, PDF - EEWORLD Datasheet

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W78L54P-24: Description8-bit microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size20KB，2 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W78L54P-24 Overview

8-bit microcontroller

W78L54P-24 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	LCC
package instruction	PLASTIC, LCC-44
Contacts	44
Reach Compliance Code	_compli
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	24 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.59 mm
Number of I/O lines	36
Number of terminals	44
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225
power supply	2/5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	16384
ROM programmability	MROM
Maximum seat height	4.699 mm
speed	24 MHz
Maximum slew rate	20 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	16.59 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

W78L54P-24 Related Products

	W78L54P-24	W78L54-24	W78L54	W78L54F-24
Description	8-bit microcontroller	8-bit microcontroller	8-bit microcontroller	8-bit microcontroller
Is it Rohs certified?	incompatible	incompatible	-	incompatible
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation
Parts packaging code	LCC	DIP	-	QFP
package instruction	PLASTIC, LCC-44	DIP-40	-	QFP-44
Contacts	44	40	-	44
Reach Compliance Code	_compli	_compli	-	_compli
Has ADC	NO	NO	-	NO
Address bus width	16	16	-	16
bit size	8	8	-	8
CPU series	8051	8051	-	8051
maximum clock frequency	24 MHz	24 MHz	-	24 MHz
DAC channel	NO	NO	-	NO
DMA channel	NO	NO	-	NO
External data bus width	8	8	-	8
JESD-30 code	S-PQCC-J44	R-PDIP-T40	-	S-PQFP-G44
JESD-609 code	e0	e0	-	e0
length	16.59 mm	52.2 mm	-	10 mm
Number of I/O lines	36	32	-	36
Number of terminals	44	40	-	44
Maximum operating temperature	70 °C	70 °C	-	70 °C
PWM channel	NO	NO	-	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP	-	QFP
Encapsulate equivalent code	LDCC44,.7SQ	DIP40,.6	-	QFP44,.5SQ,32
Package shape	SQUARE	RECTANGULAR	-	SQUARE
Package form	CHIP CARRIER	IN-LINE	-	FLATPACK
Peak Reflow Temperature (Celsius)	225	NOT SPECIFIED	-	NOT SPECIFIED
power supply	2/5 V	2/5 V	-	2/5 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified
RAM (bytes)	256	256	-	256
rom(word)	16384	16384	-	16384
ROM programmability	MROM	MROM	-	MROM
Maximum seat height	4.699 mm	5.334 mm	-	2.7 mm
speed	24 MHz	24 MHz	-	24 MHz
Maximum slew rate	20 mA	20 mA	-	20 mA
Maximum supply voltage	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage	1.8 V	1.8 V	-	1.8 V
Nominal supply voltage	2 V	2 V	-	2 V
surface mount	YES	NO	-	YES
technology	CMOS	CMOS	-	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	-	GULL WING
Terminal pitch	1.27 mm	2.54 mm	-	0.8 mm
Terminal location	QUAD	DUAL	-	QUAD
Maximum time at peak reflow temperature	30	NOT SPECIFIED	-	NOT SPECIFIED
width	16.59 mm	15.24 mm	-	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER

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