OTP ROM, 1KX8, TTL, PDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 93L450PC | 93L451FM | 93L451FC | 93L450FC | 93L451DM | 93L451DC | 93L450DM | 93L450DC | 93L450FM | 93L451PC | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 1KX8, TTL, PDIP24, | OTP ROM, 1KX8, 75ns, TTL, CDFP24, | OTP ROM, 1KX8, 60ns, TTL, CDFP24, | OTP ROM, 1KX8, TTL, CDFP24, | OTP ROM, 1KX8, 75ns, TTL, CDIP24, | OTP ROM, 1KX8, 60ns, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDFP24, | OTP ROM, 1KX8, 60ns, TTL, PDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| package instruction | DIP, DIP24,.6 | DFP, FL24,.4 | DFP, FL24,.4 | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| JESD-30 code | R-PDIP-T24 | R-XDFP-F24 | R-XDFP-F24 | R-XDFP-F24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bi |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | DFP | DFP | DIP | DIP | DIP | DIP | DFP | DIP |
| Encapsulate equivalent code | DIP24,.6 | FL24,.4 | FL24,.4 | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | YES | YES | NO | NO | NO | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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