OTP ROM, 1KX8, 60ns, TTL, CDFP24,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
package instruction | DFP, FL24,.4 |
Reach Compliance Code | compliant |
Maximum access time | 60 ns |
JESD-30 code | R-XDFP-F24 |
JESD-609 code | e0 |
memory density | 8192 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Humidity sensitivity level | 2A |
Number of terminals | 24 |
word count | 1024 words |
character code | 1000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX8 |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL24,.4 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
93L451FC | 93L451FM | 93L450FC | 93L451DM | 93L451DC | 93L450DM | 93L450DC | 93L450FM | 93L450PC | 93L451PC | |
---|---|---|---|---|---|---|---|---|---|---|
Description | OTP ROM, 1KX8, 60ns, TTL, CDFP24, | OTP ROM, 1KX8, 75ns, TTL, CDFP24, | OTP ROM, 1KX8, TTL, CDFP24, | OTP ROM, 1KX8, 75ns, TTL, CDIP24, | OTP ROM, 1KX8, 60ns, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDIP24, | OTP ROM, 1KX8, TTL, CDFP24, | OTP ROM, 1KX8, TTL, PDIP24, | OTP ROM, 1KX8, 60ns, TTL, PDIP24, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
package instruction | DFP, FL24,.4 | DFP, FL24,.4 | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
JESD-30 code | R-XDFP-F24 | R-XDFP-F24 | R-XDFP-F24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bi |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DFP | DFP | DFP | DIP | DIP | DIP | DIP | DFP | DIP | DIP |
Encapsulate equivalent code | FL24,.4 | FL24,.4 | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | NO | NO | NO | NO | YES | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |