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S2031C-10

Description
Telecom IC, Bipolar, CQFP100
CategoryWireless rf/communication    Telecom circuit   
File Size1011KB,21 Pages
ManufacturerApplied Micro Circuits (MACOM)
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S2031C-10 Overview

Telecom IC, Bipolar, CQFP100

S2031C-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerApplied Micro Circuits (MACOM)
package instructionQFP, QFP100,.9SQ
Reach Compliance Codecompli
JESD-30 codeS-XQFP-G100
JESD-609 codee0
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.9SQ
Package shapeSQUARE
Package formFLATPACK
power supply5,-4.5/-5.2 V
Certification statusNot Qualified
surface mountYES
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
This Material Copyrighted By Its Respective Manufacturer

S2031C-10 Related Products

S2031C-10 S2030A-10 S2030B-10 S2030C-10 S2031A-10 S2031B-10
Description Telecom IC, Bipolar, CQFP100 Telecom Circuit, Bipolar, CQFP100, Telecom Circuit, Bipolar Telecom Circuit, Bipolar, CQFP100, Telecom IC, Bipolar, CQFP100 Telecom IC, Bipolar
Maker Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM)
package instruction QFP, QFP100,.9SQ QFF, HQFL100,.75SQ,25 , DIE OR CHIP QFP, QFP100,.9SQ QFF, HQFL100,.75SQ,25 , DIE OR CHIP
Reach Compliance Code compli compli compli compli compli compli
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Encapsulate equivalent code QFP100,.9SQ HQFL100,.75SQ,25 DIE OR CHIP QFP100,.9SQ HQFL100,.75SQ,25 DIE OR CHIP
power supply 5,-4.5/-5.2 V 5,-4.5/-5.2 V 5,-4.5/-5.2 V 5,-4.5/-5.2 V 5,-4.5/-5.2 V 5,-4.5/-5.2 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Is it Rohs certified? incompatible incompatible - incompatible incompatible -
JESD-30 code S-XQFP-G100 S-XQFP-F100 - S-XQFP-G100 S-XQFP-F100 -
JESD-609 code e0 e0 - e0 e0 -
Number of terminals 100 100 - 100 100 -
Package body material CERAMIC CERAMIC - CERAMIC CERAMIC -
encapsulated code QFP QFF - QFP QFF -
Package shape SQUARE SQUARE - SQUARE SQUARE -
Package form FLATPACK FLATPACK - FLATPACK FLATPACK -
surface mount YES YES - YES YES -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form GULL WING FLAT - GULL WING FLAT -
Terminal pitch 0.635 mm 0.635 mm - 0.635 mm 0.635 mm -
Terminal location QUAD QUAD - QUAD QUAD -
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