Telecom IC, Bipolar
| Parameter Name | Attribute value |
| Maker | Applied Micro Circuits (MACOM) |
| package instruction | , DIE OR CHIP |
| Reach Compliance Code | compli |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Encapsulate equivalent code | DIE OR CHIP |
| power supply | 5,-4.5/-5.2 V |
| Certification status | Not Qualified |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| S2031B-10 | S2030A-10 | S2030B-10 | S2030C-10 | S2031A-10 | S2031C-10 | |
|---|---|---|---|---|---|---|
| Description | Telecom IC, Bipolar | Telecom Circuit, Bipolar, CQFP100, | Telecom Circuit, Bipolar | Telecom Circuit, Bipolar, CQFP100, | Telecom IC, Bipolar, CQFP100 | Telecom IC, Bipolar, CQFP100 |
| Maker | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) |
| package instruction | , DIE OR CHIP | QFF, HQFL100,.75SQ,25 | , DIE OR CHIP | QFP, QFP100,.9SQ | QFF, HQFL100,.75SQ,25 | QFP, QFP100,.9SQ |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Encapsulate equivalent code | DIE OR CHIP | HQFL100,.75SQ,25 | DIE OR CHIP | QFP100,.9SQ | HQFL100,.75SQ,25 | QFP100,.9SQ |
| power supply | 5,-4.5/-5.2 V | 5,-4.5/-5.2 V | 5,-4.5/-5.2 V | 5,-4.5/-5.2 V | 5,-4.5/-5.2 V | 5,-4.5/-5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | incompatible |
| JESD-30 code | - | S-XQFP-F100 | - | S-XQFP-G100 | S-XQFP-F100 | S-XQFP-G100 |
| JESD-609 code | - | e0 | - | e0 | e0 | e0 |
| Number of terminals | - | 100 | - | 100 | 100 | 100 |
| Package body material | - | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | - | QFF | - | QFP | QFF | QFP |
| Package shape | - | SQUARE | - | SQUARE | SQUARE | SQUARE |
| Package form | - | FLATPACK | - | FLATPACK | FLATPACK | FLATPACK |
| surface mount | - | YES | - | YES | YES | YES |
| Terminal surface | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | FLAT | - | GULL WING | FLAT | GULL WING |
| Terminal pitch | - | 0.635 mm | - | 0.635 mm | 0.635 mm | 0.635 mm |
| Terminal location | - | QUAD | - | QUAD | QUAD | QUAD |
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