S2030B-10 datasheet, PDF - EEWORLD Datasheet

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S2030B-10: DescriptionTelecom Circuit, Bipolar; CategoryWireless rf/communication Telecom circuit; File Size1011KB，21 Pages; ManufacturerApplied Micro Circuits (MACOM)

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S2030B-10 Overview

Telecom Circuit, Bipolar

S2030B-10 Parametric

Parameter Name	Attribute value
Maker	Applied Micro Circuits (MACOM)
package instruction	, DIE OR CHIP
Reach Compliance Code	compli
Maximum operating temperature	70 °C
Minimum operating temperature
Encapsulate equivalent code	DIE OR CHIP
power supply	5,-4.5/-5.2 V
Certification status	Not Qualified
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL

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S2030B-10 Related Products

	S2030B-10	S2030A-10	S2030C-10	S2031A-10	S2031B-10	S2031C-10
Description	Telecom Circuit, Bipolar	Telecom Circuit, Bipolar, CQFP100,	Telecom Circuit, Bipolar, CQFP100,	Telecom IC, Bipolar, CQFP100	Telecom IC, Bipolar	Telecom IC, Bipolar, CQFP100
Maker	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)	Applied Micro Circuits (MACOM)
package instruction	, DIE OR CHIP	QFF, HQFL100,.75SQ,25	QFP, QFP100,.9SQ	QFF, HQFL100,.75SQ,25	, DIE OR CHIP	QFP, QFP100,.9SQ
Reach Compliance Code	compli	compli	compli	compli	compli	compli
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Encapsulate equivalent code	DIE OR CHIP	HQFL100,.75SQ,25	QFP100,.9SQ	HQFL100,.75SQ,25	DIE OR CHIP	QFP100,.9SQ
power supply	5,-4.5/-5.2 V	5,-4.5/-5.2 V	5,-4.5/-5.2 V	5,-4.5/-5.2 V	5,-4.5/-5.2 V	5,-4.5/-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Is it Rohs certified?	-	incompatible	incompatible	incompatible	-	incompatible
JESD-30 code	-	S-XQFP-F100	S-XQFP-G100	S-XQFP-F100	-	S-XQFP-G100
JESD-609 code	-	e0	e0	e0	-	e0
Number of terminals	-	100	100	100	-	100
Package body material	-	CERAMIC	CERAMIC	CERAMIC	-	CERAMIC
encapsulated code	-	QFF	QFP	QFF	-	QFP
Package shape	-	SQUARE	SQUARE	SQUARE	-	SQUARE
Package form	-	FLATPACK	FLATPACK	FLATPACK	-	FLATPACK
surface mount	-	YES	YES	YES	-	YES
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	-	FLAT	GULL WING	FLAT	-	GULL WING
Terminal pitch	-	0.635 mm	0.635 mm	0.635 mm	-	0.635 mm
Terminal location	-	QUAD	QUAD	QUAD	-	QUAD

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