At present, the leading new energy vehicle companies have gradually completed the upgrade and transformation of electronic and electrical architecture, from distributed to domain centralized, and some have even begun to emerge the prototype of a central computing architecture. Consumers' deeper pursuit of intelligent functions not only "engulfs" OEMs, but also brings unprecedented opportunities to in-vehicle AI chips.
According to Gartner, the global automotive AI chip market will increase to US$23.6 billion by 2025, of which the Chinese market will capture US$6.8 billion. This number is expected to further increase to US$12.4 billion in 2030, with a compound annual growth rate of 28.14 %.
This is destined to be an era of disruption. During the traditional distributed E/E architecture, Renesas, NXP, Texas Instruments, etc. occupied the vast majority of the automotive chip market share. After that, Qualcomm relied on its huge consumer electronics business advantages to show an overwhelming advantage in the field of smart cockpits. At present, the standard configuration solutions of domestic mainstream mid-to-high-end smart cars mostly revolve around "Qualcomm Snapdragon 8155 + NVIDIA Orin". However, as the human-vehicle interaction model becomes more complex and the replacement cycle of new cars shortens, new product solutions are emerging.
Crazy smart cockpit kills SoC
Image source: Telechips Inc.
If the power battery is the heart of future cars, then the on-board AI SoC is like a brain. Data shows that the penetration rate of new cars with smart cockpit configurations in the Chinese market is around 50%, and is expected to exceed 75% by 2025. The industry generally believes that smart cockpits have entered the 2.0 era, with new and old players competing hand-to-hand, and more complete product solutions have become a company's core competitiveness.
Telechips Inc., which has been involved in the field of automotive chips for many years, obviously has more say. In 2011, Tailixin defeated NXP and became the IVI chip supplier for Hyundai Motor's mid-range models. In the past two years, Tailixin has continued to expand its chip supply to Hyundai. In 2021, Tailixin smart cockpit chip Dolphin 3 was shipped to a Chinese automobile brand for the first time, and mass production was achieved in the same year. By this year, the new generation cockpit solution Dolphin5 will also be released and is expected to be put into mass production in 2024.
Dolphin5 is a heterogeneous integrated automotive-grade SoC with built-in functional safety design that complies with ASIL-B standards, and includes CPU, GPU, ISP, NPU and high-bandwidth and low-latency LPDDR4/LPDDR5 memory channels, which can provide intelligent cockpit solutions. The application provides comprehensive computing power support. The chip is built on an 8-nanometer advanced low-power process, has a CPU computing power of more than 70K DMIPS, and supports 5 channels of display output and 8 channels of video input. Compared with the previous generation chip, the computing power of Dolphin 5 is increased by 1.5 times, and the computing power of NPU is increased by 8 times to 8TOPS, which is basically the same as Qualcomm Snapdragon 8155.
The accelerated upgrade of cockpit intelligence means that the data to be processed is more complex, which is reflected in the growing demand for computing power in the chip field. At the same time, as the richness of cockpit functions increases, in addition to linkage between multiple screens, higher-end desktop games and other applications are also accelerating in the car, and these put higher demands on the main control "brain" of the cockpit.
Image source: Telechips Inc.
For example, a single Dolphin5 can run dual in-vehicle LCD instrument (Cluster) and infotainment (IVI) systems at the same time. Based on the hardware isolation design, the two systems can be relatively independent when starting in parallel to access hardware resources. The built-in Cortex-R5 runs a high-real-time, high-reliability RTOS system as a super monitor. When a problem occurs in one system, it can be reset independently to ensure that the functions of each other do not interfere with each other.
Compared with dual-chip dual systems, single-chip dual systems meet the needs of diversified automotive application scenarios and can effectively reduce material costs (BOM). Each system is relatively independent and the technology can be reused. To a certain extent, it can also shorten the product development cycle of the OEM and speed up the pace of market launch.
What’s more worth mentioning is that in the face of the increasing complexity, accuracy and bandwidth issues of wireless communications in the 5G era, Tailixin has implemented Dolphin5’s software-defined radio (SDR) through its software capabilities.
SDR utilizes programmable DSP technology to replace traditional analog systems consisting of RF filters, modulator chipsets, etc. Simply put, it is a core technology that can implement a variety of broadcast systems by simply changing software without changing hardware. The software solution can be adjusted for vehicles exported to different countries to meet the broadcast system requirements of different regions such as Europe, North America, and India, greatly reducing costs and increasing the convenience and efficiency of development.
Of course, no matter how good the technology is, you can only know the true meaning through practice. According to Gasgoo, Dolphin5 can support up to 5 screens and consumes only 13.5W of power. Not only that, this SoC also supports fast startup. For example, a Linux system can be started in 2 seconds.
AI’s Everest, the courageous climber
For this Korean unicorn company, China's new energy vehicles are likely to become a key force that once again subverts the automotive AI chip market. The battle for cockpit chips has already begun, and the battle for autonomous driving SoC is also in full swing. At present, the penetration rate of L1 and L2 autonomous vehicles among the models sold globally has exceeded 50%. In the first half of 2022, the penetration rate of L2 autonomous passenger vehicles in my country has increased to 30%.
Therefore, this year, Tailixin will also release the N-Dolphin series of autonomous driving SoCs to occupy a place in this market that is not yet fully mature. N-Dolphin uses 14nm process technology, with a CPU computing power of 13KDMIPS and an AI computing power of 8TOPS. At the same time, the built-in ISP achieves higher integration and can support camera input up to 5.4MP 60fps and connect up to 4 cameras.
The chip is mainly used for target monitoring of front-facing ADAS cameras, driver monitoring, cockpit monitoring systems (DMS/IMS), and electronic rearview mirrors. It can effectively identify pedestrians, cars, bicycles, motorcycles, traffic signs/signals, Road surface and other information. When used in ADAS cameras, its power consumption is as low as 3W~5W. In addition, N-Dolphin also supports T-RVM (Trust-Rear View Mirror) with hardware functional safety. Even if the CPU is down, the camera input can still continue to display the output.
Compared with cockpit chips, autonomous driving SoCs have already entered the "leapfrog" competition in terms of computing power. For example, NVIDIA's Thor, which has a single chip computing power of 1,000 TOPS, is more than ten times higher than Tesla's FSD single chip, which has a computing power of 72 TOPS. Especially as ChatGPT becomes more and more popular, the demand for computing power seems to have no boundaries. But in fact, to measure the quality of a chip, computing power is only one dimension. Two chips with the same computing power, the one that can make the software run more efficiently is the better chip.
At the same time, some people believe that as cross-border integration becomes a trend, some functions in the body domain and smart driving domain may be integrated into the cockpit domain based on vehicle safety and real-time processing needs. Some car companies may choose SoC chips provided by the same supplier in the future, mainly because the software adaptability can be better. And this is Tailixin's advantage.
According to the plan, Tailixin will launch an 8nm 120K DMIPS Dolphin7 chip between 2024 and 2025; it also plans to launch an 8nm 250 TOPS A2X autonomous driving chip in 2024 that can connect 12 cameras.
In addition to cockpit and ADAS chips, Tailixin also owns two major automotive-grade product lines, including gateway chips and MCUs. Earlier, Tailixin invested in Autosilicon, a company focusing on new energy vehicle battery management chips. The ATS7001 and ATS7001ATS7002 series successfully developed by the latter have passed the ASIL-D highest automotive safety level certification and are expected to be in mass production by the end of 2022. , and officially entered the Chinese market.
With the trend of cars becoming more and more intelligent and connected, Tailixin has segmented the market demand and planned SoC, MCU, ADAS, Gateway, and BMIC chip products with different performance and price. Some product series adopt PIN TO PIN. The solution allows customers to upgrade their products at a lower cost and more conveniently.
As a global chip design company, Tailixin has stable foundry production capacity in the United States, South Korea and Taiwan, China, and can provide customers with more flexible supply channels and shorter delivery cycles. At the same time, we have FAE and sales teams stationed in Shanghai, Shenzhen, Dalian and other places in mainland China, which can quickly respond to customers' technical support needs and solve customers' technical problems in a timely manner.
The new energy vehicle market seems to be full of opportunities, but in fact it also has many challenges. After all, automobile intelligence has not yet come to an end. If you want to fight to the end, you must show your true skills and the advantages of a comprehensive service system.
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