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IS61WV102416FBLL-10T2LI-TR

Description
Standard SRAM,
Categorystorage    storage   
File Size637KB,19 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS61WV102416FBLL-10T2LI-TR Overview

Standard SRAM,

IS61WV102416FBLL-10T2LI-TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
package instructionTSOP2,
Reach Compliance Codecompliant
Factory Lead Time8 weeks
Maximum access time10 ns
JESD-30 codeR-PDSO-G54
length22.22 mm
memory density16777216 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals54
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

IS61WV102416FBLL-10T2LI-TR Related Products

IS61WV102416FBLL-10T2LI-TR IS61WV102416FBLL-10BLI IS61WV102416FBLL-10T2LI IS61WV102416FBLL-10TLI IS61WV102416FBLL-8TLI IS61WV102416FBLL-8TLI-TR
Description Standard SRAM, Standard SRAM, 1MX16, 10ns, CMOS, PBGA48, MINIBGA-48 Standard SRAM, 1MX16, 10ns, CMOS, PDSO54, TSOP2-54 Standard SRAM, 1MX16, 10ns, CMOS, PDSO48, TSOP1-48 Standard SRAM, 1MX16, 8ns, CMOS, PDSO48, TSOP1-48 Standard SRAM,
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
package instruction TSOP2, TFBGA, TSOP2, TSOP1, TSOP1, TSOP1,
Reach Compliance Code compliant compliant compliant compliant compliant compliant
Factory Lead Time 8 weeks 8 weeks 8 weeks 8 weeks 8 weeks 8 weeks
Maximum access time 10 ns 10 ns 10 ns 10 ns 8 ns 8 ns
JESD-30 code R-PDSO-G54 R-PBGA-B48 R-PDSO-G54 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 22.22 mm 8 mm 22.22 mm 18.4 mm 18.4 mm 18.4 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of terminals 54 48 54 48 48 48
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TFBGA TSOP2 TSOP1 TSOP1 TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 3 V 3.3 V 3.3 V 3.3 V 3.3 V 3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING BALL GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.75 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL BOTTOM DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 6 mm 10.16 mm 12 mm 12 mm 12 mm
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