|
IS61WV102416FBLL-10TLI |
IS61WV102416FBLL-10BLI |
IS61WV102416FBLL-10T2LI |
IS61WV102416FBLL-10T2LI-TR |
IS61WV102416FBLL-8TLI |
IS61WV102416FBLL-8TLI-TR |
Description |
Standard SRAM, 1MX16, 10ns, CMOS, PDSO48, TSOP1-48 |
Standard SRAM, 1MX16, 10ns, CMOS, PBGA48, MINIBGA-48 |
Standard SRAM, 1MX16, 10ns, CMOS, PDSO54, TSOP2-54 |
Standard SRAM, |
Standard SRAM, 1MX16, 8ns, CMOS, PDSO48, TSOP1-48 |
Standard SRAM, |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
package instruction |
TSOP1, |
TFBGA, |
TSOP2, |
TSOP2, |
TSOP1, |
TSOP1, |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
Factory Lead Time |
8 weeks |
8 weeks |
8 weeks |
8 weeks |
8 weeks |
8 weeks |
Maximum access time |
10 ns |
10 ns |
10 ns |
10 ns |
8 ns |
8 ns |
JESD-30 code |
R-PDSO-G48 |
R-PBGA-B48 |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G48 |
R-PDSO-G48 |
length |
18.4 mm |
8 mm |
22.22 mm |
22.22 mm |
18.4 mm |
18.4 mm |
memory density |
16777216 bit |
16777216 bit |
16777216 bit |
16777216 bit |
16777216 bit |
16777216 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
memory width |
16 |
16 |
16 |
16 |
16 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
48 |
48 |
54 |
54 |
48 |
48 |
word count |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
1048576 words |
character code |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
1000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
1MX16 |
1MX16 |
1MX16 |
1MX16 |
1MX16 |
1MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP1 |
TFBGA |
TSOP2 |
TSOP2 |
TSOP1 |
TSOP1 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.4 V |
2.4 V |
2.4 V |
2.4 V |
2.4 V |
2.4 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3 V |
3.3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
BALL |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.75 mm |
0.8 mm |
0.8 mm |
0.5 mm |
0.5 mm |
Terminal location |
DUAL |
BOTTOM |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
12 mm |
6 mm |
10.16 mm |
10.16 mm |
12 mm |
12 mm |