IS61WV102416FBLL-10BLI datasheet, PDF

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IS61WV102416FBLL-10BLI: DescriptionStandard SRAM, 1MX16, 10ns, CMOS, PBGA48, MINIBGA-48; Categorystorage storage; File Size637KB，19 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS61WV102416FBLL-10BLI Overview

Standard SRAM, 1MX16, 10ns, CMOS, PBGA48, MINIBGA-48

IS61WV102416FBLL-10BLI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TFBGA,
Reach Compliance Code	compliant
Factory Lead Time	8 weeks
Maximum access time	10 ns
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	16777216 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

IS61WV102416FBLL-10BLI Related Products

	IS61WV102416FBLL-10BLI	IS61WV102416FBLL-10T2LI	IS61WV102416FBLL-10T2LI-TR	IS61WV102416FBLL-10TLI	IS61WV102416FBLL-8TLI	IS61WV102416FBLL-8TLI-TR
Description	Standard SRAM, 1MX16, 10ns, CMOS, PBGA48, MINIBGA-48	Standard SRAM, 1MX16, 10ns, CMOS, PDSO54, TSOP2-54	Standard SRAM,	Standard SRAM, 1MX16, 10ns, CMOS, PDSO48, TSOP1-48	Standard SRAM, 1MX16, 8ns, CMOS, PDSO48, TSOP1-48	Standard SRAM,
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	TFBGA,	TSOP2,	TSOP2,	TSOP1,	TSOP1,	TSOP1,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
Factory Lead Time	8 weeks	8 weeks	8 weeks	8 weeks	8 weeks	8 weeks
Maximum access time	10 ns	10 ns	10 ns	10 ns	8 ns	8 ns
JESD-30 code	R-PBGA-B48	R-PDSO-G54	R-PDSO-G54	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48
length	8 mm	22.22 mm	22.22 mm	18.4 mm	18.4 mm	18.4 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	48	54	54	48	48	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP2	TSOP2	TSOP1	TSOP1	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3 V	3.3 V	3.3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.75 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	10.16 mm	10.16 mm	12 mm	12 mm	12 mm

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