|
IRF1310NSHR |
IRF1310N |
IRF1310NSTRLHR |
IRF1310NHR |
Description |
Power Field-Effect Transistor, 42A I(D), 100V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, D2PAK-3/2 |
Power MOSFET(Vdss=100V, Rds(on)=0.036ohm, Id=42A) |
Power Field-Effect Transistor, 42A I(D), 100V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, D2PAK-3/2 |
Power Field-Effect Transistor, 42A I(D), 100V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220AB, 3 PIN |
Maker |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
Parts packaging code |
D2PAK |
TO-220AB |
D2PAK |
TO-220AB |
package instruction |
SMALL OUTLINE, R-PSSO-G2 |
FLANGE MOUNT, R-PSFM-T3 |
SMALL OUTLINE, R-PSSO-G2 |
FLANGE MOUNT, R-PSFM-T3 |
Contacts |
3 |
3 |
3 |
3 |
Reach Compliance Code |
compliant |
compli |
unknown |
unknow |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Other features |
AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
AVALANCHE RATED |
AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
AVALANCHE RATED, ULTRA LOW ON-RESISTANCE, HIGH RELIABILITY |
Avalanche Energy Efficiency Rating (Eas) |
420 mJ |
420 mJ |
420 mJ |
420 mJ |
Shell connection |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
100 V |
100 V |
100 V |
100 V |
Maximum drain current (ID) |
42 A |
42 A |
42 A |
42 A |
Maximum drain-source on-resistance |
0.036 Ω |
0.036 Ω |
0.036 Ω |
0.036 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-PSSO-G2 |
R-PSFM-T3 |
R-PSSO-G2 |
R-PSFM-T3 |
Number of components |
1 |
1 |
1 |
1 |
Number of terminals |
2 |
3 |
2 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
FLANGE MOUNT |
SMALL OUTLINE |
FLANGE MOUNT |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
Maximum pulsed drain current (IDM) |
140 A |
140 A |
140 A |
140 A |
surface mount |
YES |
NO |
YES |
NO |
Terminal form |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
Terminal location |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
- |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
- |
JESD-609 code |
e0 |
e0 |
e0 |
- |
Peak Reflow Temperature (Celsius) |
225 |
225 |
NOT SPECIFIED |
- |
Terminal surface |
TIN LEAD |
Tin/Lead (Sn/Pb) |
TIN LEAD |
- |
Maximum time at peak reflow temperature |
30 |
30 |
NOT SPECIFIED |
- |