MM74HC573N/A+ datasheet, PDF - EEWORLD Datasheet

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MM74HC573N/A+: DescriptionIC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC; Categorylogic logic; File Size259KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MM74HC573N/A+ Overview

IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC

MM74HC573N/A+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
Logic integrated circuit type	D LATCH
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MM74HC573N/A+ Related Products

	MM74HC573N/A+	MM74HCT573N/A+	MM74HC573WM/A+	MM54HC573J/883	MM74HC573J/A+
Description	IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	SOP, SOP20,.4	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-PDIP-T20	R-PDIP-T20	R-PDSO-G20	R-XDIP-T20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
Number of digits	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	20	20	20	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	SOP20,.4	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	2/6 V	5 V	2/6 V	2/6 V	2/6 V
surface mount	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL

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