IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D LATCH |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 2/6 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MM54HC573J/883 | MM74HCT573N/A+ | MM74HC573WM/A+ | MM74HC573N/A+ | MM74HC573J/A+ | |
|---|---|---|---|---|---|
| Description | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | R-XDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 2/6 V | 5 V | 2/6 V | 2/6 V | 2/6 V |
| surface mount | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
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