IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
Logic integrated circuit type | D LATCH |
MaximumI(ol) | 0.008 A |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
MM74HCT573N/A+ | MM74HC573WM/A+ | MM54HC573J/883 | MM74HC573N/A+ | MM74HC573J/A+ | |
---|---|---|---|---|---|
Description | IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC | IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
JESD-30 code | R-PDIP-T20 | R-PDSO-G20 | R-XDIP-T20 | R-PDIP-T20 | R-PDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
Number of digits | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
surface mount | NO | YES | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |