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MM74HCT573N/A+

Description
IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC
Categorylogic    logic   
File Size259KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

MM74HCT573N/A+ Overview

IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC

MM74HCT573N/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP20,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T20
JESD-609 codee0
Logic integrated circuit typeD LATCH
MaximumI(ol)0.008 A
Number of digits8
Number of functions1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

MM74HCT573N/A+ Related Products

MM74HCT573N/A+ MM74HC573WM/A+ MM54HC573J/883 MM74HC573N/A+ MM74HC573J/A+
Description IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC IC,LATCH,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP20,.3 SOP, SOP20,.4 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown unknow
JESD-30 code R-PDIP-T20 R-PDSO-G20 R-XDIP-T20 R-PDIP-T20 R-PDIP-T20
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type D LATCH D LATCH D LATCH D LATCH D LATCH
Number of digits 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -55 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 SOP20,.4 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
power supply 5 V 2/6 V 2/6 V 2/6 V 2/6 V
surface mount NO YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
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