TS83006VE8 datasheet, PDF - EEWORLD Datasheet

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TS83006VE8: DescriptionADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68; CategoryAnalog mixed-signal IC converter; File Size487KB，15 Pages; ManufacturerAtmel (Microchip)

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TS83006VE8 Overview

ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68

TS83006VE8 Parametric

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	LCC
package instruction	HQCCN,
Contacts	68
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum analog input voltage	1 V
Minimum analog input voltage	-1 V
Converter type	ADC, FLASH METHOD
JESD-30 code	S-CQCC-N68
length	24.13 mm
Maximum linear error (EL)	0.7812%
Nominal negative supply voltage	-5.2 V
Number of analog input channels	1
Number of digits	6
Number of functions	1
Number of terminals	68
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output bit code	BINARY, 2\'S COMPLEMENT BINARY
Output format	PARALLEL, WORD
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG
Certification status	Not Qualified
Sampling rate	600 MHz
Maximum seat height	3.115 mm
Nominal supply voltage	3 V
surface mount	YES
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	24.13 mm

TS83006VE8 Related Products

	TS83006VE8	TS83006ME8	TS83006CE8	TS83006CE1B/C	JTS83006-1VA
Description	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68	ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, 3.30 X 2.20 MM, DIE-34
Parts packaging code	LCC	LCC	LCC	LCC	DIE
package instruction	HQCCN,	HQCCN,	HQCCN,	HQCCN,	DIE,
Contacts	68	68	68	68	34
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	3A001.A.2.C	EAR99	EAR99	EAR99
Maximum analog input voltage	1 V	1 V	1 V	1 V	1 V
Minimum analog input voltage	-1 V	-1 V	-1 V	-1 V	-1 V
Converter type	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD	ADC, FLASH METHOD
JESD-30 code	S-CQCC-N68	S-CQCC-N68	S-CQCC-N68	S-CQCC-N68	R-XUUC-N34
Maximum linear error (EL)	0.7812%	0.7812%	0.7812%	0.7812%	0.3906%
Nominal negative supply voltage	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Number of analog input channels	1	1	1	1	1
Number of digits	6	6	6	6	6
Number of functions	1	1	1	1	1
Number of terminals	68	68	68	68	34
Maximum operating temperature	85 °C	125 °C	70 °C	70 °C	25 °C
Minimum operating temperature	-40 °C	-55 °C	-	-	25 °C
Output bit code	BINARY, 2\'S COMPLEMENT BINARY	BINARY, 2'S COMPLEMENT BINARY	BINARY, 2'S COMPLEMENT BINARY	BINARY, 2'S COMPLEMENT BINARY	BINARY, 2\'S COMPLEMENT BINARY
Output format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	HQCCN	HQCCN	HQCCN	HQCCN	DIE
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Sampling rate	600 MHz	600 MHz	600 MHz	600 MHz	600 MHz
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	INDUSTRIAL	MILITARY	COMMERCIAL	COMMERCIAL	OTHER
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	QUAD	QUAD	QUAD	QUAD	UPPER
Maker	Atmel (Microchip)	-	-	Atmel (Microchip)	Atmel (Microchip)
length	24.13 mm	24.13 mm	24.13 mm	24.13 mm	-
Maximum seat height	3.115 mm	3.115 mm	3.115 mm	3.115 mm	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-
width	24.13 mm	24.13 mm	24.13 mm	24.13 mm	-
Base Number Matches	-	1	1	1	-

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