ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, 3.30 X 2.20 MM, DIE-34
Parameter Name | Attribute value |
Maker | Atmel (Microchip) |
Parts packaging code | DIE |
package instruction | DIE, |
Contacts | 34 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum analog input voltage | 1 V |
Minimum analog input voltage | -1 V |
Converter type | ADC, FLASH METHOD |
JESD-30 code | R-XUUC-N34 |
Maximum linear error (EL) | 0.3906% |
Nominal negative supply voltage | -5.2 V |
Number of analog input channels | 1 |
Number of digits | 6 |
Number of functions | 1 |
Number of terminals | 34 |
Maximum operating temperature | 25 °C |
Minimum operating temperature | 25 °C |
Output bit code | BINARY, 2\'S COMPLEMENT BINARY |
Output format | PARALLEL, WORD |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Certification status | Not Qualified |
Sampling rate | 600 MHz |
Nominal supply voltage | 3 V |
surface mount | YES |
technology | BIPOLAR |
Temperature level | OTHER |
Terminal form | NO LEAD |
Terminal location | UPPER |
JTS83006-1VA | TS83006ME8 | TS83006CE8 | TS83006CE1B/C | TS83006VE8 | |
---|---|---|---|---|---|
Description | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, 3.30 X 2.20 MM, DIE-34 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 |
Parts packaging code | DIE | LCC | LCC | LCC | LCC |
package instruction | DIE, | HQCCN, | HQCCN, | HQCCN, | HQCCN, |
Contacts | 34 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 |
Maximum analog input voltage | 1 V | 1 V | 1 V | 1 V | 1 V |
Minimum analog input voltage | -1 V | -1 V | -1 V | -1 V | -1 V |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | R-XUUC-N34 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 |
Maximum linear error (EL) | 0.3906% | 0.7812% | 0.7812% | 0.7812% | 0.7812% |
Nominal negative supply voltage | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
Number of analog input channels | 1 | 1 | 1 | 1 | 1 |
Number of digits | 6 | 6 | 6 | 6 | 6 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 34 | 68 | 68 | 68 | 68 |
Maximum operating temperature | 25 °C | 125 °C | 70 °C | 70 °C | 85 °C |
Minimum operating temperature | 25 °C | -55 °C | - | - | -40 °C |
Output bit code | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIE | HQCCN | HQCCN | HQCCN | HQCCN |
Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | UNCASED CHIP | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Sampling rate | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | OTHER | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | QUAD | QUAD | QUAD | QUAD |
Maker | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) |
length | - | 24.13 mm | 24.13 mm | 24.13 mm | 24.13 mm |
Maximum seat height | - | 3.115 mm | 3.115 mm | 3.115 mm | 3.115 mm |
Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
width | - | 24.13 mm | 24.13 mm | 24.13 mm | 24.13 mm |
Base Number Matches | - | 1 | 1 | 1 | - |