ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68
Parameter Name | Attribute value |
Parts packaging code | LCC |
package instruction | HQCCN, |
Contacts | 68 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum analog input voltage | 1 V |
Minimum analog input voltage | -1 V |
Converter type | ADC, FLASH METHOD |
JESD-30 code | S-CQCC-N68 |
length | 24.13 mm |
Maximum linear error (EL) | 0.7812% |
Nominal negative supply voltage | -5.2 V |
Number of analog input channels | 1 |
Number of digits | 6 |
Number of functions | 1 |
Number of terminals | 68 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output bit code | BINARY, 2'S COMPLEMENT BINARY |
Output format | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | HQCCN |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG |
Certification status | Not Qualified |
Sampling rate | 600 MHz |
Maximum seat height | 3.115 mm |
Nominal supply voltage | 3 V |
surface mount | YES |
technology | BIPOLAR |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 24.13 mm |
Base Number Matches | 1 |
TS83006CE8 | TS83006ME8 | TS83006CE1B/C | JTS83006-1VA | TS83006VE8 | |
---|---|---|---|---|---|
Description | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, 3.30 X 2.20 MM, DIE-34 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 |
Parts packaging code | LCC | LCC | LCC | DIE | LCC |
package instruction | HQCCN, | HQCCN, | HQCCN, | DIE, | HQCCN, |
Contacts | 68 | 68 | 68 | 34 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 |
Maximum analog input voltage | 1 V | 1 V | 1 V | 1 V | 1 V |
Minimum analog input voltage | -1 V | -1 V | -1 V | -1 V | -1 V |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | R-XUUC-N34 | S-CQCC-N68 |
Maximum linear error (EL) | 0.7812% | 0.7812% | 0.7812% | 0.3906% | 0.7812% |
Nominal negative supply voltage | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
Number of analog input channels | 1 | 1 | 1 | 1 | 1 |
Number of digits | 6 | 6 | 6 | 6 | 6 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 68 | 34 | 68 |
Maximum operating temperature | 70 °C | 125 °C | 70 °C | 25 °C | 85 °C |
Minimum operating temperature | - | -55 °C | - | 25 °C | -40 °C |
Output bit code | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | HQCCN | HQCCN | HQCCN | DIE | HQCCN |
Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | UNCASED CHIP | CHIP CARRIER, HEAT SINK/SLUG |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Sampling rate | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | OTHER | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | QUAD | QUAD | QUAD | UPPER | QUAD |
length | 24.13 mm | 24.13 mm | 24.13 mm | - | 24.13 mm |
Maximum seat height | 3.115 mm | 3.115 mm | 3.115 mm | - | 3.115 mm |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
width | 24.13 mm | 24.13 mm | 24.13 mm | - | 24.13 mm |
Base Number Matches | 1 | 1 | 1 | - | - |
Maker | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |