LH28F008SCHB-TL12 datasheet, PDF

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LH28F008SCHB-TL12: DescriptionFlash, 1MX8, 170ns, PBGA42, 8 X 8 MM, CSP-42; Categorystorage storage; File Size2MB，41 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH28F008SCHB-TL12 Overview

Flash, 1MX8, 170ns, PBGA42, 8 X 8 MM, CSP-42

LH28F008SCHB-TL12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	8 X 8 MM, CSP-42
Reach Compliance Code	unknown
Maximum access time	170 ns
Other features	100000 BLOCK ERASE CYCLES
JESD-30 code	R-PBGA-B42
JESD-609 code	e0
memory density	8388608 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	42
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3.3 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE

LH28F008SCHB-TL12 Related Products

	LH28F008SCHB-TL12	LH28F008SCHR-TL85	LH28F008SCHT-TL85	LH28F008SCHN-TL85	LH28F008SCHB-TL85	LH28F008SCHR-TL12	LH28F008SCHT-TL12	LH28F008SCHN-TL12
Description	Flash, 1MX8, 170ns, PBGA42, 8 X 8 MM, CSP-42	Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40	Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40	Flash, 1MX8, 150ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44	Flash, 1MX8, 150ns, PBGA42, 8 X 8 MM, CSP-42	Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40	Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40	Flash, 1MX8, 170ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44
Maker	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP
package instruction	8 X 8 MM, CSP-42	10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40	10 X 20 MM, 1.20 MM HEIGHT, TSOP-40	0.525 X 1.110 INCH, PLASTIC, SOP-44	8 X 8 MM, CSP-42	10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40	10 X 20 MM, 1.20 MM HEIGHT, TSOP-40	0.525 X 1.110 INCH, PLASTIC, SOP-44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	170 ns	150 ns	150 ns	150 ns	150 ns	170 ns	170 ns	170 ns
Other features	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES	100000 BLOCK ERASE CYCLES
JESD-30 code	R-PBGA-B42	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44	R-PBGA-B42	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	42	40	40	44	42	40	40	44
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	TSOP1-R	TSOP1	SOP	BGA	TSOP1-R	TSOP1	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	GRID ARRAY	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	GULL WING
Terminal location	BOTTOM	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL	DUAL
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
JESD-609 code	e0	e6	e6	e6	-	e0	e6	e0
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	Tin/Lead (Sn/Pb)	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	-	Tin/Lead (Sn/Pb)	TIN BISMUTH	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
length	-	18.4 mm	18.4 mm	28.2 mm	-	18.4 mm	18.4 mm	28.2 mm
Maximum seat height	-	1.2 mm	1.2 mm	3.15 mm	-	1.2 mm	1.2 mm	3.15 mm
Terminal pitch	-	0.5 mm	0.5 mm	1.27 mm	-	0.5 mm	0.5 mm	1.27 mm
width	-	10 mm	10 mm	13.2 mm	-	10 mm	10 mm	13.2 mm

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