Flash, 1MX8, 150ns, PBGA42, 8 X 8 MM, CSP-42
Parameter Name | Attribute value |
Maker | SHARP |
package instruction | 8 X 8 MM, CSP-42 |
Reach Compliance Code | unknown |
Maximum access time | 150 ns |
Other features | 100000 BLOCK ERASE CYCLES |
JESD-30 code | R-PBGA-B42 |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 42 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 1MX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal location | BOTTOM |
type | NOR TYPE |
Base Number Matches | 1 |
LH28F008SCHB-TL85 | LH28F008SCHR-TL85 | LH28F008SCHT-TL85 | LH28F008SCHN-TL85 | LH28F008SCHR-TL12 | LH28F008SCHT-TL12 | LH28F008SCHN-TL12 | LH28F008SCHB-TL12 | |
---|---|---|---|---|---|---|---|---|
Description | Flash, 1MX8, 150ns, PBGA42, 8 X 8 MM, CSP-42 | Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | Flash, 1MX8, 150ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | Flash, 1MX8, 170ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 170ns, PBGA42, 8 X 8 MM, CSP-42 |
Maker | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
package instruction | 8 X 8 MM, CSP-42 | 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | 0.525 X 1.110 INCH, PLASTIC, SOP-44 | 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | 0.525 X 1.110 INCH, PLASTIC, SOP-44 | 8 X 8 MM, CSP-42 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 150 ns | 150 ns | 150 ns | 150 ns | 170 ns | 170 ns | 170 ns | 170 ns |
Other features | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES |
JESD-30 code | R-PBGA-B42 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G44 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G44 | R-PBGA-B42 |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 42 | 40 | 40 | 44 | 40 | 40 | 44 | 42 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | TSOP1-R | TSOP1 | SOP | TSOP1-R | TSOP1 | SOP | BGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
Terminal form | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL |
Terminal location | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
JESD-609 code | - | e6 | e6 | e6 | e0 | e6 | e0 | e0 |
length | - | 18.4 mm | 18.4 mm | 28.2 mm | 18.4 mm | 18.4 mm | 28.2 mm | - |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maximum seat height | - | 1.2 mm | 1.2 mm | 3.15 mm | 1.2 mm | 1.2 mm | 3.15 mm | - |
Terminal surface | - | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | Tin/Lead (Sn/Pb) | TIN BISMUTH | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | - | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | - |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | - | 10 mm | 10 mm | 13.2 mm | 10 mm | 10 mm | 13.2 mm | - |