1200/2400/4800 Baud FFSK Modem
| Parameter Name | Attribute value |
| Maker | CML Microcircuits |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.4 |
| Contacts | 22 |
| Reach Compliance Code | compli |
| Other features | FULL DUPLEX |
| data rate | 4.8 Mbps |
| JESD-30 code | R-PDIP-T22 |
| length | 27.685 mm |
| Number of functions | 1 |
| Number of terminals | 22 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.95 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | OTHER |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| FX469P6 | FX469DW | FX469J | FX469LG | FX469LS | FX469 | |
|---|---|---|---|---|---|---|
| Description | 1200/2400/4800 Baud FFSK Modem | 1200/2400/4800 Baud FFSK Modem | 1200/2400/4800 Baud FFSK Modem | 1200/2400/4800 Baud FFSK Modem | 1200/2400/4800 Baud FFSK Modem | 1200/2400/4800 Baud FFSK Modem |
| Maker | CML Microcircuits | CML Microcircuits | CML Microcircuits | CML Microcircuits | CML Microcircuits | - |
| Parts packaging code | DIP | SOIC | DIP | QFP | LCC | - |
| package instruction | DIP, DIP22,.4 | SOP, SOP20,.4 | DIP, DIP22,.4 | QFP, QFP24,.47SQ,30 | QCCJ, LDCC24,.44SQ | - |
| Contacts | 22 | 20 | 22 | 24 | 24 | - |
| Reach Compliance Code | compli | compli | compli | compli | compli | - |
| Other features | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX | - |
| data rate | 4.8 Mbps | 4.8 Mbps | 4.8 Mbps | 4.8 Mbps | 4.8 Mbps | - |
| JESD-30 code | R-PDIP-T22 | R-PDSO-G20 | R-GDIP-T22 | S-PQFP-G24 | S-PQCC-J24 | - |
| length | 27.685 mm | 12.8 mm | 27.18 mm | 10.125 mm | 10.16 mm | - |
| Number of functions | 1 | 1 | 1 | 1 | 1 | - |
| Number of terminals | 22 | 20 | 22 | 24 | 24 | - |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | - |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | SOP | DIP | QFP | QCCJ | - |
| Encapsulate equivalent code | DIP22,.4 | SOP20,.4 | DIP22,.4 | QFP24,.47SQ,30 | LDCC24,.44SQ | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | - |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | FLATPACK | CHIP CARRIER | - |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 4.95 mm | 2.65 mm | 5.67 mm | 2.5 mm | 3.7 mm | - |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | YES | NO | YES | YES | - |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Telecom integrated circuit types | MODEM | MODEM | MODEM | MODEM | MODEM | - |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | - |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND | - |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
| Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | - |
| width | 10.16 mm | 7.5 mm | 10.16 mm | 10.125 mm | 10.16 mm | - |
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