FX469DW datasheet, PDF - EEWORLD Datasheet

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FX469DW: Description1200/2400/4800 Baud FFSK Modem; CategoryWireless rf/communication Telecom circuit; File Size127KB，10 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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FX469DW Overview

1200/2400/4800 Baud FFSK Modem

FX469DW Parametric

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	SOIC
package instruction	SOP, SOP20,.4
Contacts	20
Reach Compliance Code	compli
Other features	FULL DUPLEX
data rate	4.8 Mbps
JESD-30 code	R-PDSO-G20
length	12.8 mm
Number of functions	1
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP20,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	OTHER
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.5 mm

FX469DW Related Products

	FX469DW	FX469J	FX469LG	FX469LS	FX469P6	FX469
Description	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits	-
Parts packaging code	SOIC	DIP	QFP	LCC	DIP	-
package instruction	SOP, SOP20,.4	DIP, DIP22,.4	QFP, QFP24,.47SQ,30	QCCJ, LDCC24,.44SQ	DIP, DIP22,.4	-
Contacts	20	22	24	24	22	-
Reach Compliance Code	compli	compli	compli	compli	compli	-
Other features	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	-
data rate	4.8 Mbps	4.8 Mbps	4.8 Mbps	4.8 Mbps	4.8 Mbps	-
JESD-30 code	R-PDSO-G20	R-GDIP-T22	S-PQFP-G24	S-PQCC-J24	R-PDIP-T22	-
length	12.8 mm	27.18 mm	10.125 mm	10.16 mm	27.685 mm	-
Number of functions	1	1	1	1	1	-
Number of terminals	20	22	24	24	22	-
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	-
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SOP	DIP	QFP	QCCJ	DIP	-
Encapsulate equivalent code	SOP20,.4	DIP22,.4	QFP24,.47SQ,30	LDCC24,.44SQ	DIP22,.4	-
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	-
Package form	SMALL OUTLINE	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE	-
power supply	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	2.65 mm	5.67 mm	2.5 mm	3.7 mm	4.95 mm	-
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	-
surface mount	YES	NO	YES	YES	NO	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM	MODEM	-
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	-
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE	-
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	-
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	-
width	7.5 mm	10.16 mm	10.125 mm	10.16 mm	10.16 mm	-

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