FX469LG datasheet, PDF - EEWORLD Datasheet

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FX469LG: Description1200/2400/4800 Baud FFSK Modem; CategoryWireless rf/communication Telecom circuit; File Size127KB，10 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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FX469LG Overview

1200/2400/4800 Baud FFSK Modem

FX469LG Parametric

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	QFP
package instruction	QFP, QFP24,.47SQ,30
Contacts	24
Reach Compliance Code	compli
Other features	FULL DUPLEX
data rate	4.8 Mbps
JESD-30 code	S-PQFP-G24
length	10.125 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP24,.47SQ,30
Package shape	SQUARE
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.5 mm
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	OTHER
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	10.125 mm

FX469LG Related Products

	FX469LG	FX469DW	FX469J	FX469LS	FX469P6	FX469
Description	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem	1200/2400/4800 Baud FFSK Modem
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits	-
Parts packaging code	QFP	SOIC	DIP	LCC	DIP	-
package instruction	QFP, QFP24,.47SQ,30	SOP, SOP20,.4	DIP, DIP22,.4	QCCJ, LDCC24,.44SQ	DIP, DIP22,.4	-
Contacts	24	20	22	24	22	-
Reach Compliance Code	compli	compli	compli	compli	compli	-
Other features	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	-
data rate	4.8 Mbps	4.8 Mbps	4.8 Mbps	4.8 Mbps	4.8 Mbps	-
JESD-30 code	S-PQFP-G24	R-PDSO-G20	R-GDIP-T22	S-PQCC-J24	R-PDIP-T22	-
length	10.125 mm	12.8 mm	27.18 mm	10.16 mm	27.685 mm	-
Number of functions	1	1	1	1	1	-
Number of terminals	24	20	22	24	22	-
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	-
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	QFP	SOP	DIP	QCCJ	DIP	-
Encapsulate equivalent code	QFP24,.47SQ,30	SOP20,.4	DIP22,.4	LDCC24,.44SQ	DIP22,.4	-
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	-
Package form	FLATPACK	SMALL OUTLINE	IN-LINE	CHIP CARRIER	IN-LINE	-
power supply	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	2.5 mm	2.65 mm	5.67 mm	3.7 mm	4.95 mm	-
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	-
surface mount	YES	YES	NO	YES	NO	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM	MODEM	-
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	-
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	-
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	-
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	-
width	10.125 mm	7.5 mm	10.16 mm	10.16 mm	10.16 mm	-

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