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W24010V-70LL

Description
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.4 MM, REVERSE, TSOP1-32
Categorystorage    storage   
File Size244KB,12 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W24010V-70LL Overview

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.4 MM, REVERSE, TSOP1-32

W24010V-70LL Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeTSOP1
package instructionTSOP1-R,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-PDSO-G32
length11.8 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width8 mm
W24010/LL
128K
×
8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24010 is a normal-speed, very low-power CMOS static RAM organized as 131072
×
8 bits that
operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
FEATURES
Low power consumption:
Active: 350 mW (max.)
Standby: 250
µW
(max.)
Access time: 70 nS (max.)
Single 5V power supply
Fully static operation
All inputs and outputs directly TTL compatible
Three-state outputs
Battery back-up operation capability
Data retention voltage: 2V (min.)
Packaged in 32-pin 600 mil DIP, 450 mil SOP,
standard type one TSOP (8 mm
×
20 mm),
reverse type one TSOP (8 mm
×
20 mm),
small type one TSOP (8 mm
×
13.4 mm) and
reverse small type one TSOP (8 mm
×
13.4
mm)
PIN CONFIGURATIONS
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
DD
A15
CS2
WE
A13
A8
A9
A11
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
BLOCK DIAGRAM
CLK GEN.
A16
A14
A12
A4
A3
A2
A7
A6
A5
A9
I/O1
:
I/O8
DATA
CNTRL.
CLK
GEN.
WE
CS1
CS2
OE
A15
A13
A8 A1 A0 A11 A10
I/O CKT.
COLUMN DECODER
R
O
W
D
E
C
O
D
E
R
PRECHARGE CKT.
CORE CELL ARRAY
1024 ROWS
128 X 8 COLUMNS
A11
A9
A8
A13
WE
CS2
A15
V
DD
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-pin
TSOP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
V
SS
I/O3
I/O2
I/O1
A0
A1
A2
A3
PIN DESCRIPTION
SYMBOL
A0−A16
I/O1−I/O8
CS1, CS2
WE
OE
V
DD
V
SS
NC
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input
Power Supply
Ground
No Connection
A4
A5
A6
A7
A12
A14
A16
NC
V
DD
A15
CS2
WE
A13
A8
A9
A11
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
32-pin
Reverse
TSOP
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
A3
A2
A1
A0
I/O1
I/O2
I/O3
V
SS
I/O4
I/O5
I/O6
I/O7
I/O8
CS1
A10
OE
-1-
Publication Release Date: April 1997
Revision A3

W24010V-70LL Related Products

W24010V-70LL W24010-70LL W24010T-70LL W24010U-70LL W24010S-70LL
Description Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.4 MM, REVERSE, TSOP1-32 Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, REVERSE, TSOP1-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.450 INCH, SOP-32
Parts packaging code TSOP1 DIP TSOP1 TSOP1 SOIC
package instruction TSOP1-R, DIP, TSOP1, TSOP1-R, SOP,
Contacts 32 32 32 32 32
Reach Compliance Code unknown unknow unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns
JESD-30 code R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
length 11.8 mm 41.91 mm 18.4 mm 18.4 mm 20.45 mm
memory density 1048576 bit 1048576 bi 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1-R DIP TSOP1 TSOP1-R SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 5.33 mm 1.2 mm 1.2 mm 3 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 2.54 mm 0.5 mm 0.5 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
width 8 mm 15.24 mm 8 mm 8 mm 11.3 mm
Maker Winbond Electronics Corporation - - Winbond Electronics Corporation Winbond Electronics Corporation
JESD-609 code - e3 e3 - e3
Terminal surface - MATTE TIN MATTE TIN - MATTE TIN
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