Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SONY |
Parts packaging code | DIP |
package instruction | DIP, DIP32,.3 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.B |
Maximum access time | 15 ns |
I/O type | COMMON |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
length | 40.2 mm |
memory density | 294912 bit |
Memory IC Type | STANDARD SRAM |
memory width | 9 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 32 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX9 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.45 mm |
Maximum standby current | 0.001 A |
Minimum standby current | 4.75 V |
Maximum slew rate | 0.14 mA |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
CXK59288P-15 | CXK59288J-17 | CXK59288J-25 | CXK59288P-25 | CXK59288P-17 | CXK59288J-15 | CXK59288P-20 | CXK59288J-20 | |
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Description | Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 17ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 17ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 | Standard SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | SOJ | SOJ | DIP | DIP | SOJ | DIP | SOJ |
package instruction | DIP, DIP32,.3 | SOJ, SOJ32,.34 | SOJ, SOJ32,.34 | DIP, DIP32,.3 | DIP, DIP32,.3 | SOJ, SOJ32,.34 | DIP, DIP32,.3 | SOJ, SOJ32,.34 |
Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.B.2.B | 3A991.B.2.B | EAR99 | EAR99 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
Maximum access time | 15 ns | 17 ns | 25 ns | 25 ns | 17 ns | 15 ns | 20 ns | 20 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDIP-T32 | R-PDSO-J32 | R-PDSO-J32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-J32 | R-PDIP-T32 | R-PDSO-J32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 40.2 mm | 20.96 mm | 20.96 mm | 40.2 mm | 40.2 mm | 20.96 mm | 40.2 mm | 20.96 mm |
memory density | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOJ | SOJ | DIP | DIP | SOJ | DIP | SOJ |
Encapsulate equivalent code | DIP32,.3 | SOJ32,.34 | SOJ32,.34 | DIP32,.3 | DIP32,.3 | SOJ32,.34 | DIP32,.3 | SOJ32,.34 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.45 mm | 3.75 mm | 3.75 mm | 4.45 mm | 4.45 mm | 3.75 mm | 4.45 mm | 3.75 mm |
Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
Minimum standby current | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.14 mA | 0.13 mA | 0.12 mA | 0.12 mA | 0.13 mA | 0.14 mA | 0.12 mA | 0.12 mA |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Maker | SONY | - | SONY | SONY | SONY | SONY | SONY | SONY |