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CXK59288P-15

Description
Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size179KB,7 Pages
ManufacturerSONY
Websitehttp://www.sony.co.jp
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CXK59288P-15 Overview

Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32

CXK59288P-15 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSONY
Parts packaging codeDIP
package instructionDIP, DIP32,.3
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length40.2 mm
memory density294912 bit
Memory IC TypeSTANDARD SRAM
memory width9
Number of functions1
Number of ports1
Number of terminals32
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX9
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.45 mm
Maximum standby current0.001 A
Minimum standby current4.75 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

CXK59288P-15 Related Products

CXK59288P-15 CXK59288J-17 CXK59288J-25 CXK59288P-25 CXK59288P-17 CXK59288J-15 CXK59288P-20 CXK59288J-20
Description Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 Standard SRAM, 32KX9, 17ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 Standard SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 Standard SRAM, 32KX9, 17ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 Standard SRAM, 32KX9, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32 Standard SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP SOJ SOJ DIP DIP SOJ DIP SOJ
package instruction DIP, DIP32,.3 SOJ, SOJ32,.34 SOJ, SOJ32,.34 DIP, DIP32,.3 DIP, DIP32,.3 SOJ, SOJ32,.34 DIP, DIP32,.3 SOJ, SOJ32,.34
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.B 3A991.B.2.B EAR99 EAR99 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 15 ns 17 ns 25 ns 25 ns 17 ns 15 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T32 R-PDSO-J32 R-PDSO-J32 R-PDIP-T32 R-PDIP-T32 R-PDSO-J32 R-PDIP-T32 R-PDSO-J32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 40.2 mm 20.96 mm 20.96 mm 40.2 mm 40.2 mm 20.96 mm 40.2 mm 20.96 mm
memory density 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ SOJ DIP DIP SOJ DIP SOJ
Encapsulate equivalent code DIP32,.3 SOJ32,.34 SOJ32,.34 DIP32,.3 DIP32,.3 SOJ32,.34 DIP32,.3 SOJ32,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.45 mm 3.75 mm 3.75 mm 4.45 mm 4.45 mm 3.75 mm 4.45 mm 3.75 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Minimum standby current 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.5 V
Maximum slew rate 0.14 mA 0.13 mA 0.12 mA 0.12 mA 0.13 mA 0.14 mA 0.12 mA 0.12 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.25 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Maker SONY - SONY SONY SONY SONY SONY SONY
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