CXK59288P-17 datasheet, PDF - EEWORLD Datasheet

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CXK59288P-17: DescriptionStandard SRAM, 32KX9, 17ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size179KB，7 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp

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CXK59288P-17 Overview

Standard SRAM, 32KX9, 17ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32

CXK59288P-17 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SONY
Parts packaging code	DIP
package instruction	DIP, DIP32,.3
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Maximum access time	17 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	40.2 mm
memory density	294912 bit
Memory IC Type	STANDARD SRAM
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.45 mm
Maximum standby current	0.001 A
Minimum standby current	4.75 V
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

CXK59288P-17 Related Products

	CXK59288P-17	CXK59288J-17	CXK59288J-25	CXK59288P-25	CXK59288P-15	CXK59288J-15	CXK59288P-20	CXK59288J-20
Description	Standard SRAM, 32KX9, 17ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Standard SRAM, 32KX9, 17ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32	Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32	Standard SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Standard SRAM, 32KX9, 15ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Standard SRAM, 32KX9, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32	Standard SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Standard SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, MO-077AC, SOJ-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOJ	SOJ	DIP	DIP	SOJ	DIP	SOJ
package instruction	DIP, DIP32,.3	SOJ, SOJ32,.34	SOJ, SOJ32,.34	DIP, DIP32,.3	DIP, DIP32,.3	SOJ, SOJ32,.34	DIP, DIP32,.3	SOJ, SOJ32,.34
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.B	3A991.B.2.B	EAR99	EAR99	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	17 ns	17 ns	25 ns	25 ns	15 ns	15 ns	20 ns	20 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T32	R-PDSO-J32	R-PDSO-J32	R-PDIP-T32	R-PDIP-T32	R-PDSO-J32	R-PDIP-T32	R-PDSO-J32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	40.2 mm	20.96 mm	20.96 mm	40.2 mm	40.2 mm	20.96 mm	40.2 mm	20.96 mm
memory density	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	SOJ	DIP	DIP	SOJ	DIP	SOJ
Encapsulate equivalent code	DIP32,.3	SOJ32,.34	SOJ32,.34	DIP32,.3	DIP32,.3	SOJ32,.34	DIP32,.3	SOJ32,.34
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.45 mm	3.75 mm	3.75 mm	4.45 mm	4.45 mm	3.75 mm	4.45 mm	3.75 mm
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Minimum standby current	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V	4.5 V
Maximum slew rate	0.13 mA	0.13 mA	0.12 mA	0.12 mA	0.14 mA	0.14 mA	0.12 mA	0.12 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maker	SONY	-	SONY	SONY	SONY	SONY	SONY	SONY

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