AS4DDR264M72PBG-3/ET datasheet, PDF

AS4DDR264M72PBG-3/ET: DescriptionDDR DRAM, 64MX72, 0.45ns, CMOS, PBGA255, 25 X 32 MM, 1.27 MM PITCH, PLASTIC, BGA-255; Categorystorage storage; File Size2MB，31 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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AS4DDR264M72PBG-3/ET Overview

DDR DRAM, 64MX72, 0.45ns, CMOS, PBGA255, 25 X 32 MM, 1.27 MM PITCH, PLASTIC, BGA-255

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Micross
Parts packaging code	BGA
package instruction	25 X 32 MM, 1.27 MM PITCH, PLASTIC, BGA-255
Contacts	255
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Maximum access time	0.45 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B255
JESD-609 code	e0
length	32 mm
memory density	4831838208 bit
Memory IC Type	DDR DRAM
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	255
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	64MX72
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	25 mm

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