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WMS512K8L-25CLIA

Description
Standard SRAM, 512KX8, 25ns, CMOS, CQCC32, BRAZED, CERAMIC, LCC-32
Categorystorage    storage   
File Size279KB,10 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WMS512K8L-25CLIA Overview

Standard SRAM, 512KX8, 25ns, CMOS, CQCC32, BRAZED, CERAMIC, LCC-32

WMS512K8L-25CLIA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFJ
package instructionBRAZED, CERAMIC, LCC-32
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time25 ns
Other featuresBATTERY BACKUP
JESD-30 codeR-CQCC-N32
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
White Electronic Designs
512Kx8 MONOLITHIC SRAM, SMD 5962-95613
FEATURES
Access Times 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Revolutionary, Center Power/Ground Pinout JEDEC
Approved
36 lead Ceramic SOJ (Package 100)
36 lead Ceramic Flat Pack (Package 226)
Evolutionary, Corner Power/Ground Pinout JEDEC
Approved
32 pin Ceramic DIP (Package 300)
32 lead Ceramic SOJ (Package 101)
32 lead Ceramic Thinpack™ Flat Pack
(Package 321)
WMS512K8-XXX
32 pin, Rectangular Ceramic Leadless Chip
Carrier (Package 601)
Commercial, Industrial and Military
Temperature Range
5V Power Supply
Low Power CMOS
Low Power Data Retention for Battery Back-up
Operation
TTL Compatible Inputs and Outputs
*This product is subject to change without notice.
REVOLUTIONARY PINOUT
36 FLAT PACK
36 CSOJ
EVOLUTIONARY PINOUT
32 DIP
32 CSOJ (DE)
32 FLAT PACK (FF)
TOP VIEW
32 CLCC
TOP VIEW
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A15
A17
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
A12
A14
A16
A18
A15
A17
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
V
CC
I/O4
TOP VIEW
A0
A1
A2
A3
A4
CS#
I/O0
I/O1
V
CC
V
SS
I/O2
I/O3
WE#
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
NC
A18
A17
A16
A15
OE#
I/O7
I/O6
V
SS
V
CC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
I/O1
I/O2
I/O3
PIN DESCRIPTION
A0-18
I/O 0-7
CS#
OE#
WE#
V
CC
GND
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
September 2007
Rev. 11
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
I/O5
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
5
29
6
28
7
27
8
26
9
25
10
24
23
11
12
22
13
21
14 15 16 17 18 19 20
V
SS
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