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ES1G

Description
1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC
Categorysemiconductor    Discrete semiconductor   
File Size156KB,3 Pages
ManufacturerYenyo Technology Co., Ltd.
Websitehttp://www.yenyo.com.tw/
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ES1G Overview

1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC

ES1G Parametric

Parameter NameAttribute value
Number of terminals2
Number of components1
Processing package descriptionPlastic, HSMA, 2 PIN
stateDISCONTINUED
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formC BEND
terminal coatingtin lead
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
structuresingle
Diode component materialssilicon
Diode typeSignal diode
Maximum reverse recovery time0.0600 us
Maximum repetitive peak reverse voltage400 V
Maximum average forward current1 A
YENYO
Surface Mount Efficient Fast Recovery Rectifier
Voltage Range 50 to 600 V
Current 1.0 Ampere
SMA/DO-214AC
ES1A THRU ES1J
Features
Fast switching for high efficiency
Low forward voltage drop
High current capability
Low reverse leakage current
High surge current capability
Glass passivated chip
Mechanical Data
Case: Molded plastic SMA/DO-214AC
Epoxy: UL 94V-0 rate flame retardant
Terminals: Solderable per MIL-STD-750
method 2026
Polarity:Color band denotes cathode
Mounting position: Any
Weight: 0.064 gram
.055(1.40)
.062(1.60)
.098(2.50)
.114(2.90)
.157(4.00)
.181(4.60)
.006(.152)
.012(.305)
.078(2.00)
.096(2.44)
.002(.051)
.008(.203)
.188(4.80)
.208(5.28)
.030(0.76)
.060(1.52)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
o
C
ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
CHARACTERISTIC
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current T
A
=55
C
Peak Forward Surge Current, 8.3ms single
Half sine-wave superimposed on rated load
(JEDEC method)
Maximum Instantaneous Forward Voltage
@ 1.0 A
Maximum DC Reverse Current @T
J
=25
C
At Rated DC Blocking Voltage @T
J
=125
C
Maximum Reverse Recovery Time (Note 1)
Typical junction Capacitance (Note 2)
Typical Thermal Resistance (Note 3)
Operating Junction and Storage
Temperature Range
o
o
o
SYMBOL
V
RRM
V
RMS
V
DC
IF
(AV)
ES1A
50
35
50
ES1B
100
70
100
ES1D
200
140
200
1.0
ES1G
400
280
400
ES1J
600
420
600
UNIT
V
V
V
A
I
FSM
30
A
V
F
I
R
Trr
C
J
R
JA
T
J
, T
STG
0.92
5.0
100
15
15
75
-55 to +150
1.3
1.5
V
uA
uA
nS
pF
o
25
50
CW
o
C
NOTES : (1) Reverse recovery test conditions I
F
= 0.5A, I
R
= 1.0A, Irr = 0.25A.
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts DC.
(3) Thermal Resistance junction to ambient.
1/2
R1, JUL-11

ES1G Related Products

ES1G ES1A ES1D ES1J ES1B
Description 1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC 1 A, 50 V, SILICON, SIGNAL DIODE 1 A, 200 V, SILICON, SIGNAL DIODE 1 A, 600 V, SILICON, SIGNAL DIODE, DO-214AC 1 A, 100 V, SILICON, SIGNAL DIODE, DO-214AC
Number of terminals 2 2 2 2 2
Number of components 1 1 1 1 1
Processing package description Plastic, HSMA, 2 PIN Plastic, SMA, 2 PIN Plastic, SMA, 2 PIN SMA, 2 PIN GREEN, PLASTIC, SMA, 2 PIN
state DISCONTINUED ACTIVE ACTIVE TRANSFERRED ACTIVE
packaging shape Rectangle Rectangle Rectangle Rectangle Rectangle
Package Size SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
surface mount Yes Yes Yes Yes Yes
Terminal form C BEND C BEND C BEND C BEND C BEND
Terminal location pair pair pair pair pair
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
structure single single single single single
Diode component materials silicon silicon silicon silicon silicon
Diode type Signal diode Signal diode Signal diode Signal diode Signal diode
Maximum reverse recovery time 0.0600 us 0.0200 us 0.0200 us 0.0600 us 0.0350 us
Maximum repetitive peak reverse voltage 400 V 50 V 200 V 600 V 100 V
Maximum average forward current 1 A 1 A 1 A 1 A 1 A
terminal coating tin lead - PURE Tin NOT SPECIFIED PURE Tin
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